Gtech Accutherm, Service Manual, Page: 96 / 132

A-viii GTECH Technical Training and Support Services
PACKAGING
General Packaging Procedures
Package and ship all modules or devices in the packaging in which they were
received from the manufacturer, whenever possible. Make sure that the packaging
is in good condition and not damaged from previous shipping or handling.
• Circuit boards offer special problems and should be inspected for delicate
components and sharp objects. Contact Manufacturing Engineering for
assistance, if needed.
• All precautions must be made to insure that product that is shipped is not
deformed or altered due to packaging used. Consideration must be given to
the fragileness of the product that is shipped for total coverage of protective
materials.
• Appropriate sized labels, elastic bands, or ESD tape must be used for
securing ESD bags. Staples cannot be used.
• Multiple Circuit Card Assemblies' must be placed in a single static
shielding bag only if they are mechanically separated with conductive or
anti-static foam. No movement between assemblies can occur.
• As a priority, Circuit Card Assemblies' must be transported in slotted,
conductive totes, with dividers spaced for tight capture. If boards are very
short, anti-static bubble wrap or anti-static foam is used to prevent
movement from slotting during handling. When conductive totes/dividers
are not available, static shielding bags protect Circuit Card Assemblies'.
Separation of Circuit Card Assemblies' by means of anti-static bubble or
thin polyethylene foam sheeting is required. Fragile parts must be
cushioned from one board to another and no ‘puncturing’ of ESD
protection is allowed.
• All IC’s must be placed in anti-static tube holders that are cut to size; then,
placed in static shielding bags for transit in kit or sales orders. Shielding
bags must be fully closed and sealed. Static shielding bags may be replaced
by conductive DIP tube shippers or bin boxes.
• IC’s that will not fit an IC tube must be placed in conductive foam. All IC
legs are inserted in foam without deforming; then, placed in static shielding
bags for transport in kit or sales orders. Shielding bags must be carefully
closed and sealed properly.
• IC's must not be placed loose in bags.
• Parts which mark or scratch easily must use supplier packaging or must be
separated by thin foam, polybag material or corrugated in a similar fashion
to the original supplier packaging.