GT-1612-MTBD
GPS&Beidou Receiver Module
www.gotop-zzu.com
Page 27 of 35
Revision: V2.0.1-January 2015
Figure 17:
Recommended Reflow Soldering Thermal Profile
6.2. Moisture Sensitivity
GT-1612-MTBD module is sensitive to moisture. To prevent GT-1612-MTBD from permanent damage during
reflow soldering, baking before reflow soldering is required in following cases:
Humidity indicator card: One or more indicating spots are no longer blue.
The seal is opened and the module is exposed to excessive humidity.
GT-1612-MTBD should be baked for 192 hours at temperature 40°C+5°C/-0°C and <5% RH in low-temperature
containers, or 24 hours at temperature 125°C±5°C in high-temperature containers. Care should be taken that the
plastic tape is not heat resistant. GT-1612-MTBD should be taken out from the tape before preheating; otherwise, the
tape maybe damaged by high-temperature heating.
6.3. ESD Protection
GT-1612-MTBD module is sensitive to ESD and requires special precautions when handling. Particular care must be
exercised when handling patch antenna, duo to the risk of electrostatic charges.
