GT-1612-MTBD
GPS&Beidou Receiver Module
www.gotop-zzu.com
Page 26 of 35
Revision: V2.0.1-January 2015
5 Mechanical Dimensions
This chapter describes the mechanical dimensions of the module.
Figure 16:
Bottom View Dimensions
6 Manufacturing, Packaging and Ordering Information
6.1. Assembly and Soldering
GT-1612-MTBD module is intended for SMT assembly and soldering in a Pb-free reflow process on the top side
of the PCB. It is suggested that the minimum height of solder paste stencil is 100um to ensure sufficient solder
volume. Pad openings of paste mask can be increased to ensure proper soldering and solder wetting over pads. It is
suggested that the peak reflow temperature is 235~245
º
C (for SnAg3.0Cu0.5 alloy). The absolute maximum reflow
temperature is 260
º
C. To avoid damage to the module when it is repeatedly heated, it is suggested that the module
should be mounted after reflow soldering for the other side of PCB has been completed. Recommended reflow
soldering thermal profile is shown below:
