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GPS Module Application Notes
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2.2.5 Ground Segmentation
Compatible Model: Gmm-r1, PA6C
In general, the separation of ground between G
recommended to avoid interference. If this is not possible, it is best to follow these typical rules:
segmentation of ground between digital and analogue system, high current and low current system,
and different radiation systems such as G
digital and noise component at one corner of the board, while placing analog and quiet components
at the opposite corner of the board. Make sure there is no crossing of microstrip
the two component sets with ground of each sets
Another way to do this is to place the two different sets at different layer
ground of each layer is contacted at
board.
2.2.6 Ground Plane
Compatible Model: PA6C-R
For module
a large GND plane directly
line of the antenna for better GP
strongly recommended to have a ground plane designed underneath the
possible.
The recommended thickness for the ground layer is 0.5 to 1 OZ (0.0175 to 0.035 mm)
place the ground plane on the top layer of the PCB, directly underneath the
the figure below.
his document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
2014 GlobalTop Technology Inc. All Rights Reserved.
Module Application Notes (MT3337 series)
Ground Segmentation
r1, PA6C-R
he separation of ground between GPS module and the rest of the system is
recommended to avoid interference. If this is not possible, it is best to follow these typical rules:
segmentation of ground between digital and analogue system, high current and low current system,
such as GPS and GPRS. One way to segment the ground is to place
digital and noise component at one corner of the board, while placing analog and quiet components
at the opposite corner of the board. Make sure there is no crossing of microstrip
round of each sets to be contacted to one point only.
place the two different sets at different layers of the board, while the
nd of each layer is contacted at one point only which is practically located
a large GND plane directly underneath the module could enhance the magnetic
PS signal reception. Typically it will improve ~2dB maximum.
strongly recommended to have a ground plane designed underneath the GPS module
he recommended thickness for the ground layer is 0.5 to 1 OZ (0.0175 to 0.035 mm)
ound plane on the top layer of the PCB, directly underneath the GPS
Ground Plane for FR4 Design
20
his document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
Specifications subject to change without prior notice.
GlobalTop Technology Inc. All Rights Reserved.
Ver. A00
module and the rest of the system is
recommended to avoid interference. If this is not possible, it is best to follow these typical rules:
segmentation of ground between digital and analogue system, high current and low current system,
ne way to segment the ground is to place
digital and noise component at one corner of the board, while placing analog and quiet components
at the opposite corner of the board. Make sure there is no crossing of microstrip or current between
one point only.
of the board, while the
located at the border of the
enhance the magnetic-field
Typically it will improve ~2dB maximum. It is
module as big as
he recommended thickness for the ground layer is 0.5 to 1 OZ (0.0175 to 0.035 mm). It is best to
module as shown in
