LVDS voltage selection
LVDS screen resolution selection
PCIe x16 and SDVO card selection jumpers
1.6 Technical Specifications
The technical specifications of the 3308290 are listed in the table below. Detailed
descriptions can be found in Chapter 2.
Specification
3308290
Form Factor
PICMG 1.3
System CPU
Intel® Core™2 Duo Mobile processor
Front Side Bus
800 MHz maximum
System Chipset
Northbridge: Intel® GME965
Southbridge: Intel® ICH8M-E
Memory
Two 240-pin 2.0 GB (max) 533 MHz or 667 MHz DDR2 DIMMs (system
max 4 GB)
Display
VGA
24-bit dual-channel LVDS
TV-out (NTSC/PAL and Max. 1080i HDTV Resolution via Component
output)
BIOS
AMI BIOS
Audio
Intel® High Definition Audio interface (implemented via a 7.1 channel
audio kit)
LAN
Two Intel® 82573L GbE Controllers
COM
Two RS-232 serial ports
USB 2.0
Ten USB 2.0 devices supported
IDE
One 40-pin IDE connects to up to one Ultra ATA33/66/100 devices
One CompactFlash® slot interfaced through the IDE interface
SATA
Three 3.0 Gb/s SATA drives supported
TPM
One 19-pin TPM module pin header
Page 17
Summary of Contents for 3308290
Page 1: ...Page i User s Manual S PICMG 1 3 SBC 3308290 Versionx1 0 ...
Page 10: ...Figure 5 21 USB Device Connection 103 Figure 5 22 VGA Connector 104 Page x ...
Page 13: ...Chapter 1 1 Introduction Page 13 ...
Page 19: ...Chapter 2 2 Detailed Specifications Page 19 ...
Page 37: ...Page 37 ...
Page 38: ...Page 38 ...
Page 39: ...Page 39 ...
Page 40: ...Chapter 3 3 Unpacking Page 40 ...
Page 44: ...Chapter 4 4 Connector Pinouts Page 44 ...