GSWP300W-EVBPA
GaN E-HEMT Wireless Power Transfer Evaluation Board
Technical Manual
_____________________________________________________________________________________________________________________
GSWP300W-EVBPA Rev 220215
© 2022 GaN Systems Inc.
www.gansystems.com 12
Please refer to the Evaluation Board/Kit Important Notice on page 27
design. Maintaining low device temperatures through proper thermal management enhances the
system reliability and extends the range of operating temperature.
The GS66508B are bottom-side cooled devices that use GaN
PX
® packaging, designed for optimal
thermal performance. For effective thermal management, a hole is cut out of the PCB to permit
access to the copper coins. The two GS66508Bs
’ bottom side thermal pads
are soldered directly onto
the copper coins on the bottom side of the PCB and the Gate, Drain and Source signals are routed on
the top side of the PCB. This set up provides an ultra-low thermal impedance from the die to the
copper coins.
Figure 12 •
Copper coins soldered beneath PCB and devices top PCB
Figure 13 •
Aluminum heatplate with housing for two copper coins.
Heatplate
