Gan Systems GS66502B-EVBDB, User Manual

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°
5. The TIM we use on this assembly is Berguist
®
SilPad 1500ST, the measured total thermal
resistance can be found in Figure 9. Compared to bottom cooled design, T package eliminates the
PCB thermal resistance and significantly improve the thermal performance. Theraml grease is
typically not needed on the assembly. If thermal grease is to be applied, use non-conductive and
non-capacitive type thermal grease.
6. Forced air cooling is recommended for power testing.