Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
Freescale Semiconductor, Inc
23
PCB manufacturing specifications
•
Copper foil
— Top and bottom copper layers must be 1 oz. copper
— Interior layers must be 1 oz. copper
•
Plating—All pad plating must be Hot Air Levelling (HAL)
5.4
Solder mask
The solder mask must meet the following requirements:
•
Solder mask type: Liquid Film Electra EMP110 or equivalent
•
Solder mask thickness: 10–30 µm
5.5
Silk screen
The silk screen must meet the following requirements:
•
Silk screen color: White
•
Silk screen must be applied after application of solder mask if solder mask is required
•
The silk screen ink must not extend into any plated-thru-holes
•
The silk screen must be clipped back to the line of resistance
5.6
Electrical PCB testing
•
All PCBs must be 100 percent tested for opens and shorts
•
Impedance measurement - An impedance measurement report is not mandatory
5.7
Packaging
Packaging for the PCBs must meet the following requirements:
•
Finished PCBs must remain in panel
•
Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability
5.8
Hole specification/tool table
See the
ncdrill-1-4.tap
file included with the Gerber files and the
FAB-28441.pdf
file.
5.9
File description
Files included with the download include Design, Gerber, and PDF files. Gerber files are RS-274x format.
Not all files included with the Gerber files are for PCB manufacturing.
PDF files included are:
•
FAB-28441.pdf
—USB- Board fabrication drawing
•
GRB-28441.zip
—USB- Metal layers, solder mask, solder paste and silk screen
