FN-LINK TECHNOLOGY LIMITED
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4. Environmental Requirements
4.1
Operating & storage tempreture
Operating
Temperature: -20°C to +70°C
Relative Humidity: 10-90% (non-condensing)
Storage
Temperature: -40°C to +80°C (non-operating)
Relative Humidity: 5-90% (non-condensing)
MTBF (Mean Time Between Failures)
Over 150,000hours
4.2 Recommended
Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times :
≤
2 times
4.3 Patch WIFI modules installed before the notice:
WIFI module installed note:
1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil
2. Take and use the WIFI module, please insure the electrostatic protective measures.
3. Reflow soldering temperature should be according to the customer the main size of the products, such as
the temperature set at 250 + 5
℃
for the MID motherboard.
About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment
conditions: temperature in: < 40
℃
, relative humidity: < 90% r.h.
2. The module vacuum packing once opened, time limit of the assembly:
Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or
greater than 40% (red) the module have been moisture absorption.
2.) factory environmental temperature humidity control:
≦
-30
℃
,
≦
60% r.h..
3). Once opened, the workshop the preservation of life for 168 hours.
