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FIBOCOM SQ806-W Series Hardware Guide
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3.16.4
Headphone Interface Circuit Design
HPH_R
0R
33
pF
HPH_L
HPH_GND
HPH_DET
MIC2_P
20K
Module
33
pF
33
pF
Figure 3-20 Headphone interface circuit design
Use a bi-directional TVS tube for the ESD protection device of the headphone interface.
3.16.5
Speaker Circuit Design
Module
SPK_M
SPK_P
33
pF
33
pF
Figure 3-21 Speaker circuit design
Note:
