F&S armStone A9, Hardware Documentation

Page: 3 / 26

Hardware Documentation armStone
™A9 | 3 of 26
Table of Contents
ESD Requirements 2
History 2
About This Document 2
Table of Contents 3
1 Dimensions 4
2 Technical Data armStoneA9 5
2.1 Thermal Specification ...................................................................................... 5
3 Block diagram 6
4 Interface and signal description 7
4.1 Gbit Ethernet LAN ........................................................................................... 8
4.2 USB Host Connector ....................................................................................... 8
4.3 USB Device Connector .................................................................................... 8
4.4 Digital Monitor Connector ................................................................................ 8
4.5 microSD Connector ......................................................................................... 8
4.6 LVDS Connectors ............................................................................................ 9
4.6.1 F&S JAE FI-S25P connector on top side ......................................................... 9
4.6.2 JILI30 JAE FI-X30S connector on bottom side ............................................... 10
4.7 ESDCI RGB connector .................................................................................. 12
4.8 Backlight control connector ............................................................................ 13
4.8.1 Solution with a single cable with 3 connectors ............................................... 13
4.8.2 Solution with 2 cable with 2 connectors each ................................................. 14
4.9 I2C connector for touch module ..................................................................... 15
4.10 Mini PCI Express ........................................................................................... 15
4.11 66 Pin Feature connector .............................................................................. 16
4.11.1 Audio ............................................................................................................. 17
4.11.2 RS232 COM port ........................................................................................... 17
4.11.3 TTL COM port ................................................................................................ 17
4.11.4 I2C/ SPI ......................................................................................................... 18
4.11.5 ADC In ........................................................................................................... 19
4.11.6 PWM out ........................................................................................................ 19
4.11.7 Matrix keyboard ............................................................................................. 19
4.11.8 GPIOs............................................................................................................ 19
4.11.9 MISC signals, power ...................................................................................... 19
4.11.10 CAN Bus ........................................................................................................ 20
4.12 Power connector ............................................................................................ 21
5 Electrical Data 22
5.1 Power supply ................................................................................................. 22
5.2 DC electrical characteristics for 3.3V IO pins ................................................. 22
5.3 Power consumption and cooling .................................................................... 23
6 Storage conditions 24
7 ROHS and REACH statement 24
8 Matrix Code Sticker 24
9 Appendix 25
Important Notice .......................................................................................................... 25