JP14-R-LP & JP14-Q-LP F
ALCOM
GPS R
ECEIVERS
V
ERSION
1.0.0
9.3 Soldering profile
Figure 11 shows the recommended solder profile for Pb-free JP14-R-LP/Q-LP units.
Figure 11:
Typical solder conditions (temperature profile, reflow conditions).
Consider for a long time in the soldering zone (with temperature higher than 217 °C)
has to be kept as short as possible to prevent component and substrate damages.
Peak temperature must not exceed 250 °C.
Please note that this soldering profile is a reference to the soldering
machine FALCOM utilizes. This profile can vary by using different paste
types, and soldering machines, and it should be adapted to the
customer application. NO liability is assumed for any damage to the
module caused while soldering.
Reflow profiles in tabular form
Profile Feature
Values
Ramp-Up Rate
< 3 K/second
Preheat- zone
–
Temperature Range
–
Time
160-180°C
100-120 seconds
Peak-zone:
–
Peak Temperature
–
Time above 217°C
240°C .. 250°C max.
65-75 seconds
Ramp-Down Rate
< 3 K/second
Note: JP14 modules can accept only one reflow process
This confidential document is the property of FALCOM and may not be copied or circulated without permission.
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