EVOC MEC 7003, Manual

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Chapter 1 Product Introduction
MEC­7003 ­ 1 ­
Chapter 1 Product Introduction
Overview
MEC­7003 is an embedded mini­type PC. The chassis adopts sheet metal structure,
which is small in appearance and compact in structure. It has fully taken the heat
dissipation and PC wiring into consideration as well as the issues related to upgrade.
As for the structure, it provides excellent airtight, dust­proof, heat dissipation and
anti­vibration performance. The product provides strong environment adaptability and
targets the high­end clients. With the abundant expansion connectors and functions
and the high performance, the product can be widely applied in video processing
fields, such as: intelligent transportation, airport flight information display systems,
digital advertisement boards, medical monitoring devices and medical B supersonic
diagnostic sets, etc.
Main Function
Microprocessor
Supports the Sandy bridge Mobile SV NON­ECC CPU of Intel
®
rPGA989 package.
Chipset
Mobile Intel
®
QM67 Express Chipset
Memory
Provides two 204Pin DDRIII SO­DIMM memory slots, supporting Un­buffered
NON­ECC and dual­channel function. The maximum memory capacity supported by
a single memory slot is up to 8GB while the total memory capacity is up to 16GB.
The PC provides one 2G memory in standard configuration.
Network Function
Provides one 10/100/1000Mbps LAN port, supporting Wake­on­LAN, LAN PXE
booting and AMT7.0 functions.