EPOX KP6-LA, User Manual

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Introduction KP6-LA
Page 1-3
processor. This is the model used in past packaging technologies like PGA, TCP,
PQFP, DIP, etc.
S.E.C. Cartridge Terminology
• Pentium
®
II Processor
The new enclosed card packaging technology is called a “Single
Edge Contact cartridge.” This is similar to previous names for
packaging technology such as PGA or TCP.
• Processor card
The green PCB (with or without components on it)
• Processor core
The silicon on the PLGA package on the PCB
• Cover
The plastic cover on the opposite side from the thermal plate.
• Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium
®
Pro processor uses Socket 8.
• Retention mechanism
Formerly ‘retention module’ the dual posts, etc. that holds the
cartridge in place.
• Thermal plate
The heatsink attachment plate.
• Heat sink supports
The support pieces that are mounted on the mainboard to provide
added support for heatsinks.
Figure 1: Pentium
®
II Processor CPU
with S.E.C. Cartridge
Processor
Printed Circuit Board
Thermal Plate
Cover
The L2 cache (TagRAM, PBSRAM)
components keep standard industry
names.
The Pentium
®
II Processor is the first
product to utilize the S.E.C. cartridge
technology and Slot 1 connector. Unless
otherwise noted, any references to
“Pentium
®
II Processor,” “Pentium
®
II
Processor/Slot 1 processor” or Proces-
sor” will apply to both the Pentium
®
II
Processor desktop processors.