SB300 FOSB FOR 300 MM WAFERS
7
User Manual | Entegris, Inc.
Kinematic Coupling Pins Relative to All Datum
The horizontal datum is defined by the kinematic
coupling (Figure 9). The machine side of the kine-
matic coupling consists of three pins of a specified
shape in a specified pattern relative to the bilateral
datum and facial datum. The kinematic coupling
pins protrude through the horizontal datum. A
FOSB cannot be effectively opened, closed, loaded,
or unloaded unless it is properly positioned on a
kinematic coupling.
Datum Orientation Relative to an SB300 FOSB
The base of the SB300 FOSB is located slightly above
the horizontal datum (Figure 10). The bilateral datum
and facial datum intersect the the FOSB vertically.
SEMI STANDARDS
—
Provided below is a brief description of each
applicable SEMI standard and how it applies
to the SB300 FOSB. Please contact your local
Entegris representative for information on
specific SEMI standard compliance issues.
SEMI E62
Provisional specification for 300 mm FIMS
SEMI E62 describes the features and basic function
of the FOSB door opening mechanism. E62 is a very
specific standard for the configuration of the equip-
ment, including registration pins, seal zones, and
latch key shape, position, motion, and torque. The
300 mm FOSB must function with these features but
the precise mating feature size, position, and design
are up to the carrier maker. The features of the FOSB
that mate with an E62 FOSB door opener are defined
by the Entegris design specification. In general, this
compatibility involves proper clearance around
and location relative to the E62 FOSB door opener
features.
Since the force required to attach the door to the
shell is greater than the door closure force designated
by SEMI E62, the SB300 FOSB is designated as “FIMS-
compatible.”
SEMI M31-0999
Provisional Mechanical Specification for FOSB
used to Transport and Ship 300 mm Wafers
SEMI M31-0999 is a standard that partially specifies
the FOSB used to ship 300 mm wafers from wafer
suppliers to their customers (typically IC manufactur-
ers). In this standard only the physical interfaces for
the FOSB are specified; no material requirements or
microcontamination limits are given. This standard
assumes that the FOSB is used in the last process in
wafer manufacturing, in acceptance and inspection,
and in transferring the wafers from a FOSB to a front
opening unified pod (FOUP) or open cassette inside
an IC manufacturing process. The FOSB is not intend-
ed to be used in IC manufacturing processes.
Figure 9. Top view of kinematic coupling
120 mm
(4.72")
2 × 80 mm
(3.15")
2 × 115 mm
(4.53")
Front of Pod
Bilateral datum
Facial datum
Figure 10. Datums and kinematic coupling
Horizontal
datum
Bilateral
datum
Facial
datum
