RXi2-UP IPC Hardware Reference Manual
Section 8
GFK-3047D
Oct 2021
Specifications
50
Section 8:
Specifications
This chapter provides specifications and useful information for the RXi2-UP IPC.
8.1
Power Consumption
The RXi2-UP IPC should be connected to a single main power supply with limited output
power (max 250 V A) with a nominal output voltage of 24 V dc (±25%), SELV according to
IEC60950-1.
Tabl
e 8-1
Input Power
Nominal Input
Input Range
Max Input Ripple
24 V
18-30 V
± 0.2 V
The current consumption can vary, depending on the CPU, load, and input voltage, as
follows:
•
18 V dc
→
4.41 A (in Burn-In at 25°C (77 °F)
•
24 V dc
→
3.33 A (in Burn-In at 25°C (77 °F)
•
30 V dc
→
2.64 A (in Burn-In at 25°C (77 °F)
Table 8-2
Power Entry
Operation
Ambient Temperature
Power
†
i3 Dual Core, 2.7
GHz,
8 GB RAM, 128 GB
SSD
XEON E3 1505 MV,
2.8 GHz,
32 GB RAM, 128 GB
SSD
UEFI Setup or shell
25°C (77 °F)
13 W
22 W
Windows 10 idle
25°C (77 °F)
9.6 W
10.1 W
Windows 7 Heavy
Load Tool
25°C (77 °F)
26 W
60 W
Windows 7 Heavy
Load Tool
60°C (140 °F)
27 W
63 W
†
Measured at shown ambient temperature. All values are typical.
Note: The consumption values include the USB keyboard and an SSD hard disk. For each
linked Ethernet channel, add 0.5 W.
8.1.1
Power Budget for Add-on Devices
The CEC09 Carrier board supports a power budget for USB devices, SATA devices, and add-
on boards up to a total of 25 W. For add-on boards on the riser board, any share between
+12 V, 5 V, and 3.3 V power consumption is possible up to 20 W maximum for all two/four
boards together.
