Embedian, Inc.
16
SMART-BEE User’s Manual Document Revision v.1.2
1.7 Document and Standard References
1.7.1. External Industry Standard Documents
eMMC (Embedded Multi-Media Card)
the eMMC electrical standard is
defined by JEDEC JESD84-B45 and the mechanical standard by
JESD84-C44 (
www.jedec.org
).
The I2C Specification,
Version 2.1, January 2000, Philips
Semiconductor (now NXP) (
www.nxp.com
).
I2S Bus Specification,
Feb. 1986 and Revised June 5, 1996, Philips
Semiconductor (now NXP) (www.nxp.com).
JTAG (Joint Test Action Group
defined by IEEE 1149.1-2001 - IEEE
Standard Test Access Port and Boundary Scan Architecture
(www.ieee.org).
MXM3 Graphics Module Mobile PCI Express Module
Electromechanical Specification,
Version 3.0, Revision 1.1, © 2009
NVIDIA Corporation (
www.mxm-sig.org
).
PICMG® EEEP Embedded EEPROM Specification,
Rev. 1.0, August
2010 (
www.picmg.org
).
SD Specifications Part 1 Physical Layer Simplified Specification,
Version 3.01, May 18, 2010, © 2010 SD Group and SD Card
Association (Secure Digital) (
www.sdcard.org
).
SPI Bus –
“Serial Peripheral Interface” - de-facto serial interface
standard defined by Motorola. A good description may be found on
Wikipedia
(http://en.wikipedia.org/wiki/Serial_Peripheral_Interface_Bus).
USB Specifications
(www.usb.org).
1.7.2. SGET Documents
SMARC_Hardware_Specification_V1p0
, version 1.0, December 20,
2012.
1.7.3. Embedian Documents
The following documents are listed for reference. The Module schematic is
not usually available outside of Embedian, without special permission. The
other schematics may be available, under NDA or otherwise. Contact your
Embedian representative for more information. The SMARC T335x
Evaluation Carrier Board Schematic is particularly useful as an example of
the implementation of various interfaces on a Carrier board.
