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Revision History 

Version Revision 

Description 

Date 

1.0 Initial 

version 

2004/11/16 

1.1 

Incorporated into standard format and “VSS” revised to “VSSD” 2005/01/17 

 

Trademark Acknowledgments 

IBM is a registered trademark and PS/2 is a trademark of IBM. 
Microsoft, MS, MS-DOS, and Windows are registered trademarks of Microsoft Corporation.  
EASY SOUND is a registered trademark of ELAN Microelectronics Corp. 

©

 2004 - 2005 ELAN Microelectronics Corporation 

All Rights Reserved 
Printed in Taiwan, ROC, 01/2005 

The contents of this manual are subject to change without notice.  ELAN Microelectronics assumes no responsibility for 
errors that may appear in this manual.  ELAN Microelectronics makes no commitment to update, or to keep current, the 
information contained in this manual.  The software described in this manual is furnished under a license or nondisclosure 
agreement, and may be used or copied only in accordance with the terms of the agreement.  

ELAN Microelectronics products are not intended for use in life support appliances, devices, or systems.  Use of ELAN 
Microelectronics products in such applications is not supported and prohibited. 

NO PART OF THE EASY SOUND AND OF THIS MANUAL MAY BE REPRODUCED OR TRANSMITTED IN 
ANY FORM OR BY ANY MEANS WITHOUT THE EXPRESS WRITTEN PERMISSION OF ELAN 
MICROELECTRONICS. 
 
 

 
 
 
 

ELAN  MICROELECTRONICS  CORPORATION

 

Headquarters: 

No. 12, Innovation Road 1 
Science-based Industrial Park 
Hsinchu, Taiwan, R.O.C. 30077 
Tel

+886 3 563-9977  

Fax

+886 3 563-9966  

http://www.emc.com.tw 

Hong Kong: 
Elan (HK) Microelectronics 
Corporation, Ltd. 

Rm. 1005B, 10/F Empire Centre 
68 Mody Road, Tsimshatsui 
Kowloon , HONG KONG 
Tel

+852 2723-3376 

Fax: +852 2723-7780 

[email protected]

 

USA: 
Elan Information Technology 
Group 

1821 Saratoga Ave., Suite 250 
Saratoga, CA 95070 
USA 
Tel

+1 408 366-8223 

Fax: +1 408 366-8220

 

Europe: 
Elan Microelectronics Corp. 
(Europe) 

Siewerdtstrasse 105 
8050 Zurich, SWITZERLAND  
Tel

+41 43 299-4060 

Fax: +41 43 299-4079 

http://www.elan-europe.com

 

Shenzhen: 
Elan Microelectronics 
Shenzhen, Ltd. 

SSMEC Bldg., 3F, Gaoxin S. Ave. 
Shenzhen Hi-Tech Industrial Park 
Shenzhen, Guandong, CHINA  
Tel

+86 755 2601-0565 

Fax: +86 755 2601-0500

 

Shanghai: 
Elan Microelectronics 
Shanghai Corporation, Ltd. 

23/Bldg. #115 Lane 572, Bibo Road 
Zhangjiang Hi-Tech Park 
Shanghai, CHINA 
Tel

+86 021 5080-3866 

Fax: +86 021 5080-4600

 

Summary of Contents for EASY SOUND eSE Series

Page 1: ...EASY SOUND eSE Series Tiny Controller Based Speech Synthesizer Pad Diagrams Doc Version 1 1 ELAN MICROELECTRONICS CORP January 2005 ...

Page 2: ... of ELAN Microelectronics products in such applications is not supported and prohibited NO PART OF THE EASY SOUND AND OF THIS MANUAL MAY BE REPRODUCED OR TRANSMITTED IN ANY FORM OR BYANY MEANS WITHOUT THE EXPRESS WRITTEN PERMISSION OF ELAN MICROELECTRONICS ELAN MICROELECTRONICS CORPORATION Headquarters No 12 Innovation Road 1 Science based Industrial Park Hsinchu Taiwan R O C 30077 Tel 886 3 563 9...

Page 3: ... eSE003 Pad Diagram 1 2 eSE005 Pad Diagram 2 3 eSE007 Pad Diagram 3 4 eSE009 Pad Diagram 4 5 eSE012 Pad Diagram 5 6 eSE015 Pad Diagram 6 7 eSE020 Pad Diagram 7 8 eSE030 Pad Diagram 8 9 eSE040 Pad Diagram 9 10 eSE060 Pad Diagram 10 11 eSe080 Pad Diagram 11 ...

Page 4: ...eSE Series iv Pad Diagrams V1 1 01 17 2005 ...

Page 5: ...2 4 383 4 3 NC 11 P2 0 317 1 383 4 4 NC 12 VSSD 460 0 367 1 5 VCC 458 9 397 9 13 NC 6 VO2 338 9 397 9 14 OSCI 459 0 381 4 7 VSSC 218 9 397 9 15 NC 8 VO1 98 9 377 9 16 NC Chip size 1180 1100 µm For PCB layout IC substrate must be connected to VSS negative power NOTE 1 VO should be floating or connected to VDD positive power when not in use 2 VSSD VSSC should be connected together with negative powe...

Page 6: ...4 0 399 1 12 VSSD 158 6 354 4 4 VO2 544 0 279 1 13 OSCI 299 0 352 4 5 VSSC 544 0 159 1 14 NC 6 VO1 524 0 39 1 15 NC 7 VDD 489 8 351 1 16 NC 8 P3 3 348 4 354 4 17 NC 9 P3 2 226 9 354 4 18 NC Chip size 1400 1050 µm For PCB layout IC substrate must be connected to VSS negative power NOTE 1 VO should be floating or connected to VDD positive power when not in use 2 VSSD negative power VSSC should be co...

Page 7: ...8 4 3 NC 11 P2 1 221 4 378 4 4 VCC 632 4 27 9 12 P2 0 346 1 378 4 5 VO2 632 4 147 9 13 VSSD 475 8 363 4 6 VSSC 632 4 267 9 14 OSCI 624 8 378 4 7 VO1 612 4 387 9 15 NC 8 VDD 148 0 363 4 16 NC Chip size 1560 1100 µm For PCB layout IC substrate must be connected to VSS negative power NOTE 1 VO should be floating or connected to VSS negative power when not in use 2 VSSD VSSC should be connected togeth...

Page 8: ...8 4 3 NC 11 P2 1 221 4 378 4 4 VCC 632 4 27 9 12 P2 0 346 1 378 4 5 VO2 632 4 147 9 13 VSSD 475 8 363 4 6 VSSC 632 4 267 9 14 OSCI 624 8 378 4 7 VO1 612 4 387 9 15 NC 8 VDD 148 0 363 4 16 NC Chip size 1560 1100 µm For PCB layout IC substrate must be connected to VSS negative power NOTE 1 VO should be floating or connected to VSS negative power when not in use 2 VSSD VSSC should be connected togeth...

Page 9: ... VCC 630 0 130 9 11 P2 2 375 9 478 4 4 VO2 630 0 250 9 12 P2 1 500 6 478 4 5 VSSC 630 0 370 9 13 P2 0 625 3 478 4 6 VO1 610 0 490 9 14 VSSD 588 4 286 2 7 VDD 118 2 463 4 15 OSCI 603 4 137 2 8 P3 3 1 8 478 4 16 NC Chip size 1540 1290 µm For PCB layout IC substrate must be connected to VSS negative power NOTE 1 VO should be floating or connected to VSS negative power when not in use 2 VSSD VSSC shou...

Page 10: ... VCC 630 0 130 9 11 P2 2 375 9 478 4 4 VO2 630 0 250 9 12 P2 1 500 6 478 4 5 VSSC 630 0 370 9 13 P2 0 625 3 478 4 6 VO1 610 0 490 9 14 VSSD 588 4 286 2 7 VDD 118 2 463 4 15 OSCI 603 4 137 2 8 P3 3 1 8 478 4 16 NC Chip size 1540 1290 µm For PCB layout IC substrate must be connected to VSS negative power NOTE 1 VO should be floating or connected to VSS negative power when not in use 2 VSSD VSSC shou...

Page 11: ... 588 0 163 9 16 P2 0 442 0 718 4 5 VO2 588 0 283 9 17 VSSD 579 6 718 4 6 VSSC 588 0 403 9 18 OSCI 573 4 541 5 7 VO1 568 0 523 9 19 NC 8 VDD 570 2 718 4 20 NC 9 P3 3 432 6 718 4 21 NC 10 P3 2 306 2 718 4 22 NC 11 P3 1 183 2 718 4 23 NC 12 P3 0 56 8 718 4 24 NC Chip size 1500 1800 µm For PCB layout IC substrate must be connected to VSS negative power NOTE 1 VO should be floating or connected to VSS ...

Page 12: ... 588 0 163 9 16 P2 0 442 0 718 4 5 VO2 588 0 283 9 17 VSSD 579 6 718 4 6 VSSC 588 0 403 9 18 OSCI 573 4 541 5 7 VO1 568 0 523 9 19 NC 8 VDD 570 2 718 4 20 NC 9 P3 3 432 6 718 4 21 NC 10 P3 2 306 2 718 4 22 NC 11 P3 1 183 2 718 4 23 NC 12 P3 0 56 8 718 4 24 NC Chip size 1500 1800 µm For PCB layout IC substrate must be connected to VSS negative power NOTE 1 VO should be floating or connected to VSS ...

Page 13: ... 588 0 293 9 16 P2 0 442 0 848 4 5 VO2 588 0 413 9 17 VSSD 579 6 848 4 6 VSSC 588 0 533 9 18 OSCI 573 4 671 5 7 VO1 568 0 653 9 19 NC 8 VDD 570 2 848 4 20 NC 9 P3 3 432 6 848 4 21 NC 10 P3 2 306 2 848 4 22 NC 11 P3 1 183 2 848 4 23 NC 12 P3 0 56 8 848 4 24 NC Chip size 1500 2050 µm For PCB layout IC substrate must be connected to VSS negative power NOTE 1 VO should be floating or connected to VSS ...

Page 14: ...C 588 0 558 9 16 P2 0 442 0 113 4 5 VO2 588 0 678 9 17 VSSD 579 6 113 4 6 VSSC 588 0 798 9 18 OSCI 573 4 936 5 7 VO1 568 0 918 9 19 NC 8 VDD 570 2 113 4 20 NC 9 P3 3 432 6 113 4 21 NC 10 P3 2 306 2 113 4 22 NC 11 P3 1 183 2 113 4 23 NC 12 P3 0 56 8 113 4 24 NC Chip size 1500 2600 µm For PCB layout IC substrate must be connected to VSS negative power NOTE 1 VO should be floating or connected to VSS...

Page 15: ...8 0 818 9 16 P2 0 442 0 1373 4 5 VO2 588 0 938 9 17 VSSD 579 6 1373 4 6 VSSC 588 0 1058 9 18 OSCI 573 4 1196 5 7 VO1 568 0 1178 9 19 NC 8 VDD 570 2 1373 4 20 NC 9 P3 3 432 6 1373 4 21 NC 10 P3 2 306 2 1373 4 22 NC 11 P3 1 183 2 1373 4 23 NC 12 P3 0 56 8 1373 4 24 NC Chip size 1500 3100 µm For PCB layout IC substrate must be connected to VSS negative power NOTE 1 VO should be floating or connected ...

Page 16: ...eSE Series 12 Pad Diagrams V1 1 01 17 2005 These diagrams are subject to change without further notice ...

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