Ebyte E32-170T30D, User Manual, Page: 17 / 21

Chengdu Ebyte Electronic Technology Co,;Ltd E32-170T30D user manual
Copyright ©2012–2019 ， Chengdu Ebyte Electronic Technology Co.,Ltd.
16
1
Turn on FEC (default)
anti-interference ability decreases. Also the
transmission distance is relatively short.
 Both communication parties must keep on
the same pages about turn-on or turn-off
FEC.
1 0 Transmission power (approximation)
The external power must make sure the ability
of current output more than 1A and ensure the
power supply ripple within 100mV.
Low power transmission is not recommended
due to its low power supply efficiency.
1 0 Transmission power (approximation)
0 0
30dBm(default)
0 0 27dBm
0 1 24dBm
1 0 21dBm
For example: The meaning of No.3 "SPED" byte:
The binary bit of the byte
7 6 5 4 3 2 1 0
Configures by user
0 0 0 1 1 0 1 0
Meaning
UART parity bit 8N1 UART baud rate is 9600 Air data rate is 2.4k
Corresponding hexadecimal
1 A
8. Hardware design
 It is reco mmended to use a DC stabilized power supply. The power supply ripple factor is as s mall as possible, and
the module needs to be reliably grounded.
；
 Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module
；
 Please check the power supply to ensure it is within the reco mmended voltage otherwise when it exceeds the
maximu m value the module will be permanently damaged
；
 Please check the stability of the power supply, the voltage can not be fluctuated frequently
；
 When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation.
；

The module should be as far away as possible fro m the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference.
；
 High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the
module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the
copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of
the module and routed in the Bottom Layer
；