Chengdu Ebyte Electronic Technology Co.,Ltd.
E220-900M22S User Manual
Copyright ©2012–2021
，
Chengdu Ebyte Electronic Technology Co.,Ltd.
10
7 Production guidance
7.1
Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Minimum preheating
temperature
100 degrees
150 degrees.
Preheat temperature max (Tsmax)
Maximum preheating
temperature
150 degrees.
200 degrees
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rising rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid temperature
183 degrees.
217 degrees.
Time
（
tL
）
Maintained Above
（
TL
）
Time above liquidus
60-90 sec
30-90 sec
Peak temperature
（
Tp
）
Peak temperature
220-235 degrees
230 to 250 degrees.
Aveage ramp-down rate
（
Tp to Tsmax
）
Average descent rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time from 25 ℃ to peak
temperature
6 minutes max
8 minutes max
