Chengdu Ebyte Electronic Technology Co.,Ltd.
E220-400M30S User Manual
Copyright ©2012–2021
，
Chengdu Ebyte Electronic Technology Co.,Ltd.
7
7
TXEN
Input
RF switch emission control pin, connected to external MCU IO or dio2,
high level effective
8
DIO2
Input / output
Configurable universal IO port (see llcc68 manual for details)
9
VCC
Power supply, range 3V ~ 5.5V (it is recommended to add ceramic filter
capacitor externally)
10
VCC
Power supply, range 3V ~ 5.5V (it is recommended to add ceramic filter
capacitor externally)
11
GND
Ground, connect to power reference ground
12
GND
Ground, connect to power reference ground
13
DIO1
Input / output
Configurable universal IO port (see LLCC68 manual for details)
14
BUSY
Output
For status indication (see LLCC68 manual for details)
15
NRST
Input
Chip reset trigger input pin, low level effective
16
MISO
Output
SPI data output pin
17
MOSI
Input
SPI data input pin
18
SCK
Input
SPI clock input pin
19
NSS
Input
The module chip selection pin is used to start a SPI communication
20
GND
Ground, connect to power reference ground
21
ANT
RF interface, stamp hole
22
GND
Ground, connect to power reference ground
For the pin definition, software driver and communication protocol of the module, please refer to the official LLCC68
datasheet of Semtech.
4 Basic operation
4.1 Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and
the module needs to be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply, such as reverse
connection may cause permanent damage to the module;
Please check the power supply to ensure that it is between the recommended supply voltage. If it exceeds the
maximum value, the module will be permanently damaged;
Please check the stability of the power supply. The voltage should not fluctuate greatly and frequently;
When designing the power supply circuit for the module, it is often recommended to keep more than 30% margin,
which is conducive to the long-term stable operation of the whole machine;
The module should be far away from the power supply, transformer, high frequency wiring and other parts with
large electromagnetic interference;
The high-frequency digital wiring, high-frequency analog wiring and power wiring must avoid the lower part of the
module. If it is necessary to pass through the lower part of the module, it is assumed that the module is welded on
the top layer, and the copper is laid on the top layer of the module contact part (all copper is laid and well grounded),
which must be close to the digital part of the module and laid on the bottom layer;
