Chengdu Ebyte Electronic Technology Co.,Ltd
E22-900M22S User manual
Copyright ©2012–2018
，Chengdu Ebyte Electronic Technology Co.,Ltd
8
Chapter 7 Welding operation guidance
7.1 Reflow soldering temperature
Profile Feature
curve feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Minimum preheating
temperature
100
℃
150
℃
Preheat temperature max (Tsmax)
Maximum preheating
temperature
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts)
Warm up time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rate of rise
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
Temperature of the
liquid phase
183
℃
217
℃
Time
（
tL
）
Maintained Above
（
TL
）
Time above the liquidus
60-90 sec
30-90 sec
Peak temperature
（
Tp
）
Peak temperature
220-235
℃
230-250
℃
Aveage ramp-down rate
（
Tp to Tsmax
）
Average rate of decline
6
℃
/second max
6
℃
/second max
Time 25
℃
to peak temperature
Time from 25
°
C to
peak temperature
6 minutes max
8 minutes max
