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27
12 Welding Operation Instructions
12.1 Reflow soldering temperature
Reflow Soldering Profile Characteristics
leaded process assembly
Lead-free process assembly
Preheat
/
keep warm
Minimum
temperature
( Tsmin )
100
°
C
150
°
C
Maximum
temperature
( Tsmax )
150
°
C
200
°
C
Time ( Tsmin~Tsmin )
60-120 seconds
60-120 seconds
Heating slope ( TL~Tp )
3
°
C / sec, max
3
°
C / sec, max
Liquidus temperature ( TL )
183
°
C
217
°
C
Hold time above TL
60~90 seconds
60~90 seconds
Package peak temperature Tp
Users should not exceed the
temperature indicated on the
product's "Moisture Sensitivity"
label.
Users should not exceed the
temperature indicated on the
product's "Moisture Sensitivity"
label.
The time ( Tp ) within 5
°
C of the
specified classification temperature ( Tc ) ,
see the figure below
20 seconds
30 seconds
Cooling slope ( Tp~TL )
6
°
C / sec, max
6
°
C / sec, max
Time from room temperature to peak
temperature
6 minutes, maximum
8 minutes, maximum
※
The peak temperature ( Tp ) tolerance definition of the temperature curve is the upper limit of the user
12.2 Reflow Soldering Curve
