Chengdu Ebyte Electronic Technology Co.,Ltd
E01-2G4M01S1B User Manual
Copyright ©2012–2018, Chengdu Ebyte Electronic Technology Co.,Ltd
1-5
Pin No.
Pin item
Pin direction
Application
1
VCC
Power supply
2.0 ~ 3.6V
2
CE
Input
Module control pin
3
CSN
Input
Chip select pin for starting new SPI communication
4
SCK
Input
SPI clock pin
5
MOSI
Input
SPI data input pin
6
MISO
Output
SPI data output pin
7
IRQ
Output
Interrupt request
，
valid in low level
8
GND
Ground, connected to power reference ground
9
GND
Ground, connected to power reference ground
10
GND
Ground, connected to power reference ground
4 Basic operation
4.1 Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible,
and the module needs to be reliably grounded.
；
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module
；
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged
；
Please check the stability of the power supply, the voltage cannot be fluctuated frequently
；
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of
the margin, so the whole machine is beneficial for long-term stable operation.
；
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and
other parts with large electromagnetic interference.
；
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the
module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and
the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital
part of the module and routed in the Bottom Layer
；
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom
Layer or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees
；
