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ALWAYS A STEP AHEAD
7
EN
3.2 Device environment, safety and handling instructions
Please observe the safety instructions compiled below to avoid fire, electric shocks, injuries and
damage to the device.
Protect the unit from
• exposure to strong infrared radiation, such as direct sunlight,
• strong magnetic fields, such as those occurring in the immediate vicinity of an MRI,
• the impact of strong electromagnetic radiation,
• exposure to strong ionizing radiation, such as occurs at the C-arm of an X-ray machine,
• as well as from strong shocks and vibrations over longer periods of time.
The device may only be operated under the following environmental conditions:
Operation
Storage
Temperature
0 to 35 °C
32 to 104 °F
-10 to 60 °C
14 to 140 °F
Humidity
10 to 90%
non-condensing
5 to 70%
non-condensing
Height
0 to 3.048 m
0 to 10,000 ft
0 to 12.192 m
0 to 40,000 ft
Pressure
105 to 70 kPa
105 to 19 kPa
Store the device for three hours at its new operating location before commissioning if the tem-
perature difference during transport is more than 10 °C. Rapid temperature changes can cause
damage to the device, e.g. due to condensation.
Avoid displaying the same screen content for an extended period of time. Otherwise, TFT displays
may show afterimages at least temporarily (image sticking effect).
3.3 Electromagnetic compatibility (EMC)
The use of cables and accessories other than those supplied may adversely affect EMC. Under
certain circumstances, this may mean that compliance with the limit values assured at the time of
delivery can no longer be assumed.
Output lines intended for direct connection to lines in the outdoor area are not covered within the
scope of the warranted EMC properties of the device. Additional tests may be necessary for this
purpose.
Stacking devices and mounting them in close proximity to other electrical devices may cause
interference and malfunction of both devices. Ensure sufficient distance or appropriate shielding
between the devices.
Summary of Contents for OR-PC 21
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