28
Conclusion:
In the electric products line, especially the PC and electric production field,
component trend to microminiaturization, multi function and greening of management, various
capsulation technology spring up, and BGA/CSP is the main trend
In order to satisfy the growing need of BGA device circuit assembly,
manufacturers should choose more safe, more convenient, more speedily assembly
and repair equipment craft
Attachment: packing list
NO
Name
Specification & type
Unit
Qua
ntity
Note
NO
1
BGA rework station
DH-G200
set
1
Touch
screen
2
display
set
1
3
Vacuum sucker
pcs
1
/
4
Vacuum pad
copy
2
/
5
manual
DH-G200
pcs
1
/
6
Hot air nozzl
Upper nozzle
31*31/38*38/41*41
Bottom nozzle
34*34/55*55
pcs
5
/
7
Abnormity clip
pcs
6
/
8
Blossom knob
pcs
6
/
9
Supporting screw
Pcs
6
/
