Specifications
General specifications
Digi XBee® RR RF Module Hardware Reference Manual
23
General specifications
The following table describes the general specifications for the devices.
Specification
XBee RR micro-mount
Operating frequency band
ISM 2.4 – 2.4835 GHz
Form factor
Micro-mount
Dimensions
Micro-mount: 1.36 cm x 1.93 cm x 0.241 cm (0.534 in x 0.760 in x
0.095 in)
Weight
1.2 g
Operating temperature
-40 to 85 °C (industrial)
Antenna options
RF pad or U.FL connector
Analog-to-digital converter
(ADC)
4 10-bit analog inputs
Electrical characteristics
The following table lists the electrical characteristics for the XBee RR RF Module.
Symbol
Parameter
Condition
Min
Typical
Max
Units
V
I
Input pins
-0.3
VCC
+0.3
V
V
IL
Input low voltage
0.3 *
VCC
V
V
IH
Input high voltage
0.7 *
VCC
V
V
OL
Output low
voltage
Sinking 3 mA VCC = 3.3 V
0.2 *
VCC
V
V
OH
Output high
voltage
Sourcing 3 mA VCC = 3.3 V
0.8 *
VCC
V
I
IN
Input leakage
current
High Z state I/O connected to
Ground or VCC
0.1
100
nA
RPU
Internal pull-up
resistor
Enabled
40
-
k
Ω
RPD
Internal pull-down
resistor
Enabled
40
-
k
Ω
* XBee power supply should be designed to operate at 1.8V or above.
Power requirements
The following table describes the power requirements for the XBee RR RF Module.
