DFI CR100-CRM, User Manual

Page: 9 / 177

1
9
Introduction
Processor
Chipset
System Memory
Expansion Slots
Chapter 1 - Introduction
•
Socket G2 988B for:
- 3rd Generation Intel
®
Core
TM
processors
(22nm process technology)
: Intel
®
Core™ i7-3610QE (6M Cache, up to 3.3 GHz); 45W
: Intel
®
Core™ i5-3610ME (3M Cache, up to 3.3 GHz); 35W
: Intel
®
Core™ i3-3120ME (3M Cache, 2.4 GHz); 35W
- 2nd Generation Intel
®
Core
TM
processors
(32nm process technology)
: Intel
®
Core™ i7-2710QE (6M Cache, up to 3.0 GHz); 45W
: Intel
®
Core™ i5-2510E (3M Cache, up to 3.1 GHz); 35W
: Intel
®
Core™ i3-2330E (3M Cache, 2.2 GHz); 35W
: Intel
®
Celeron
®
B810 (2M Cache, 1.6 GHz); 35W
• Intel
®
QM77 Express chipset
• Two 204-pin SODIMM sockets
• Supports DDR3 SODIMM
3rd Generation Processors 2nd Generation Processors
DDR3 1066/1333/1600MHz DDR3 1066/1333MHz
(i5/i3/Celeron)
DDR3 1600MHz (i7)
• Supports DDR3L SODIMM
- 1066/1333MHz when operating at 1.35V
- 1066/1333/1600MHz when operating at 1.5V
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuf-
fered, non-ECC
• 1 PCIe x16 slot
- Supports Gen 3.0 (3rd generation processors)
- Supports Gen 2.0 (2nd generation processors)
- Configurations (supported only via a riser card):
: One x8 (GFX) and two x4 (I/O)
: Two x8 (GFX, I/O)
: One x16 (GFX, I/O)
• 2 DFI Proprietary Extension Bus for PCIe/PCI expansion
• 1 Mini PCIe slot (PCIe and USB signals)
- Supports half size Mini PCIe card
Specifications