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Chapter 2
HARDWARE INSTALLATION
User's Manual |
AL701
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LPDDR4 3200MHz Memory Down
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Up to 4G or 8G Memory Down
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Dual channel memory interface
X
System Memory
X
Heat Sink
Features
The system board supports the following memory interface.
Single Channel (SC)
Data will be accessed in chunks of 64 bits from the memory channels.
Dual Channel (DC)
Data will be accessed in chunks of 128 bits from the memory channels. Dual channel provides
better system performance because it doubles the data transfer rate.
Single Channel
DIMMs are on the same channel. DIMMs in a channel can be identi-
cal or completely different. However, we highly recommend using
identical DIMMs. Not all slots need to be populated.
Dual Channel
DIMMs of the same memory configuration are on different channels.
Top View of Heat Sink
Bottom View of Heat Sink
The metal interfaces at the bottom side of the heat sink are designed to directly contact the
chipset and passively absorb heat from them into the heat sink for heat dissipation. Additional
thermal adhesives can be applied to the metal interface to maximize contact area between the
interface and the chipset.
CPU metal interface
Memory metal interface
The heat sink is only included in certain standard package options. A heat spread-
er may be included instead.
