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ADVANCE

CY14E102L, CY14E102N

Document Number: 001-45755 Rev. *A

Page 4 of 21

Device Operation

The CY14E102L/CY14E102N nvSRAM is made up of two
functional components paired in the same physical cell. They are
an SRAM memory cell and a nonvolatile QuantumTrap cell. The
SRAM memory cell operates as a standard fast static RAM. Data
in the SRAM is transferred to the nonvolatile cell (the STORE
operation), or from the nonvolatile cell to the SRAM (the RECALL
operation). Using this unique architecture all cells are stored and
recalled in parallel. During the STORE and RECALL operations
SRAM read and write operations are inhibited. The
CY14E102L/CY14E102N supports infinite reads and writes
similar to a typical SRAM. In addition, it provides infinite RECALL
operations from the nonvolatile cells and up to 200K STORE
operations.

SRAM Read

The CY14E102L/CY14E102N performs a READ cycle when CE
and OE are LOW, and WE and HSB are HIGH. The address
specified on pins A

0-17

 

or A

0-16

 determines which of the 262, 144

data bytes or 131, 072 words of 16 bits each is accessed. When
the read is initiated by an address transition, the outputs are valid
after a delay of t

AA

. If the read is initiated by CE or OE, the

outputs are valid at t

ACE

 or at t

DOE

, whichever is later. The data

outputs repeatedly respond to address changes within the t

AA

access time without the need for transitions on any control input
pins. This remains valid until another address change or until CE
or OE is brought HIGH, or WE or HSB is brought LOW.

SRAM Write

A WRITE cycle is performed whenever CE and WE are LOW and
HSB is HIGH. The address inputs must be stable before entering
the WRITE cycle and must remain stable until either CE or WE
goes high at the end of the cycle. The data on the common IO
pins DQ

0–15

 are written into the memory if the data is valid t

SD

before the end of a WE controlled WRITE or before the end of
an CE controlled WRITE. It is recommended that OE be kept
HIGH during the entire WRITE cycle to avoid data bus contention
on common IO lines. If OE is left LOW, internal circuitry turns off
the output buffers t

HZWE 

after WE goes LOW.

AutoStore Operation

The CY14E102L/CY14E102N stores data to the nvSRAM using
one of the following three storage operations: Hardware Store
activated by HSB, Software Store activated by an address
sequence, and AutoStore on device power down. The AutoStore
operation is a unique feature of QuantumTrap technology and is
enabled by default on the CY14E102L/CY14E102N.

During a normal operation, the device draws current from V

CC

 to

charge a capacitor connected to the V

CAP

 pin. This stored

charge is used by the chip to perform a single STORE operation.
If the voltage on the V

CC

 pin drops below V

SWITCH

, the part

automatically disconnects the V

CAP

 pin from V

CC

. A STORE

operation is initiated with power provided by the V

CAP

 capacitor.

Figure 4 

shows the proper connection of the storage capacitor

(V

CAP

) for automatic store operation. Refer to the section 

DC

Electrical Characteristics

 on page 7 for the size of V

CAP 

To reduce unnecessary nonvolatile stores, AutoStore and
Hardware Store operations are ignored unless at least one
WRITE operation has taken place since the most recent STORE
or RECALL cycle. Software initiated STORE cycles are
performed regardless of whether a WRITE operation has taken
place. Monitor the HSB signal by the system to detect if an
AutoStore cycle is in progress. 

Figure 4.  AutoStore Mode

Hardware STORE Operation

The CY14E102L/CY14E102N provides the HSB pin for
controlling and acknowledging the STORE operations. Use the
HSB pin to request a hardware STORE cycle. When the HSB pin
is driven LOW, the CY14E102L/CY14E102N conditionally
initiates a STORE operation after t

DELAY

. An actual STORE cycle

only begins if a WRITE to the SRAM took place since the last
STORE or RECALL cycle. The HSB pin also acts as an open
drain driver that is internally driven LOW to indicate a busy
condition while the STORE (initiated by any means) is in
progress.

SRAM READ and WRITE operations that are in progress when
HSB is driven LOW by any means are given time to complete
before the STORE operation is initiated. After HSB goes LOW,
the CY14E102LL/CY14E102N continues SRAM operations for
t

DELAY

. During t

DELAY

, multiple SRAM READ operations may take

place. If a WRITE is in progress when HSB is pulled low it is
allowed a time, t

DELAY

 to complete. However, any SRAM WRITE

cycles requested after HSB goes LOW is inhibited until HSB
returns HIGH.

During any STORE operation, regardless of how it was initiated,
the CY14E102L/CY14E102N continues to drive the HSB pin
LOW, releasing it only when the STORE is complete. Upon
completion of the STORE operation, the
CY14E102L/CY14E102N remains disabled until the HSB pin
returns HIGH. Leave the HSB unconnected if it is not used.

0.1uF

Vcc

10k

Ohm

V

CAP

Vcc

WE

V

CAP

V

SS

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Summary of Contents for CY14E102L

Page 1: ...unctional Description The Cypress CY14E102L CY14E102N is a fast static RAM with a nonvolatile element in each memory cell The memory is organized as 256K words of 8 bits each or 128K words of 16 bits each The embedded nonvolatile elements incorporate QuantumTrap technology producing the world s most reliable nonvolatile memory The SRAM provides infinite read and write cycles while independent nonv...

Page 2: ...ale Notes 2 Address expansion for 4 Mbit NC pin not connected to die 3 Address expansion for 8 Mbit NC pin not connected to die 4 Address expansion for 16 Mbit NC pin not connected to die NC A8 NC NC VSS DQ6 DQ5 DQ4 VCC A13 DQ3 A12 DQ2 DQ1 DQ0 OE A9 CE NC A0 A1 A2 A3 A4 A5 A6 A11 A7 A14 A15 A16 A17 NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 3...

Page 3: ...utput lines depending on operation WE Input Write Enable Input Active LOW When selected LOW data on the IO pins is written to the address location latched by the falling edge of CE CE Input Chip Enable Input Active LOW When LOW selects the chip When HIGH deselects the chip OE Input Output Enable Active LOW The active LOW OE input enables the data output buffers during read cycles IO pins are tri s...

Page 4: ...nce and AutoStore on device power down The AutoStore operation is a unique feature of QuantumTrap technology and is enabled by default on the CY14E102L CY14E102N During a normal operation the device draws current from VCC to charge a capacitor connected to the VCAP pin This stored charge is used by the chip to perform a single STORE operation If the voltage on the VCC pin drops below VSWITCH the p...

Page 5: ...uence After the tSTORE cycle time is fulfilled the SRAM is activated again for the READ and WRITE operation Software RECALL Transfer the data from the nonvolatile memory to the SRAM with a software address sequence A software RECALL cycle is initiated with a sequence of READ operations in a manner similar to the software STORE initiation To initiate the RECALL cycle the following sequence of CE co...

Page 6: ...utoStore Enable If the AutoStore function is disabled or re enabled a manual STORE operation hardware or software must be issued to save the AutoStore state through subsequent power down cycles The part comes from the factory with AutoStore enabled Data Protection The CY14E102L CY14E102N protects data from corruption during low voltage conditions by inhibiting all externally initiated STORE and wr...

Page 7: ...strial 75 70 70 52 mA mA mA ICC2 Average VCC Current during STORE All Inputs Don t Care VCC Max Average current for duration tSTORE 6 mA ICC3 9 AverageVCC Currentat tRC 200 ns 5V 25 C typical WE VCC 0 2 All other I P cycling Dependent on output loading and cycle rate Values obtained without output loads 35 mA ICC4 Average VCAP Current during AutoStore Cycle All Inputs Don t Care VCC Max Average cu...

Page 8: ...ut Capacitance 7 pF Thermal Resistance The following table lists the thermal resistance parameters 11 Parameter Description Test Conditions 48 FBGA 44 TSOP II 54 TSOP II Unit ΘJA Thermal Resistance Junction to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance in accordance with EIA JESD51 28 82 31 11 30 73 C W ΘJC Thermal Resistance Junction to Cas...

Page 9: ... ns tPD 11 tPS Chip Disable to Power Standby 15 20 25 45 ns tDBE Byte Enable to Data Valid 10 10 12 20 ns tLZBE Byte Enable to Output Active 0 0 0 0 ns tHZBE Byte Disable to Output Inactive 7 8 10 15 ns SRAM Write Cycle tWC tWC Write Cycle Time 15 20 25 45 ns tPWE tWP Write Pulse Width 10 15 20 30 ns tSCE tCW Chip Enable To End of Write 15 15 20 30 ns tSD tDW Data Setup to End of Write 5 8 10 15 n...

Page 10: ...0 70 70 μs Hardware STORE Cycle Parameters Description CY14E102L CY14E102N Unit Min Max tDELAY 22 Time allowed to complete SRAM cycle 1 70 μs tHLHX Hardware STORE pulse width 15 ns Notes 16 tHRECALL starts from the time VCC rises above VSWITCH 17 If an SRAM Write has not taken place since the last nonvolatile cycle no STORE takes place 18 The software sequence is clocked with CE controlled or OE c...

Page 11: ...and OE Controlled 12 23 25 tRC tAA tOHA ADDRESS DQ DATA OUT DATA VALID ADDRESS tRC CE tACE tLZCE tPD tHZCE OE tDOE tLZOE DATA VALID ACTIVE STANDBY tPU DQ DATA OUT ICC tLZBE tDBE tHZBE HZOE t tHZCE BHE BLE Notes 23 HSB must remain HIGH during READ and WRITE cycles 24 CE or WE must be VIH during address transitions 25 BHE and BLE are applicable for x16 configuration only Feedback ...

Page 12: ...23 Figure 8 SRAM Write Cycle 2 CE Controlled 13 21 22 23 Switching Waveforms continued tWC tSCE tHA tAW tSA tPWE tSD tHD tHZWE tLZWE ADDRESS CE WE DATA IN DATA OUT DATA VALID HIGH IMPEDANCE PREVIOUS DATA BHE BLE tBW tWC ADDRESS tSA tSCE tHA tAW tPWE tSD tHD CE WE DATA IN DATA OUT HIGH IMPEDANCE DATA VALID BHE BLE tBW Feedback ...

Page 13: ... STORE RECALL Cycle 19 Switching Waveforms continued VCC VSWITCH tSTORE tSTORE tHRECALL tHRECALL AutoStore POWER UP RECALL Read Write Inhibited STORE occurs only if a SRAM write has happened No STORE occurs without atleast one SRAM write tVCCRISE Note 26 Read and Write cycles are ignored during STORE RECALL and while VCC is below VSWITCH Feedback ...

Page 14: ...d Software STORE RECALL Cycle 19 Figure 12 Hardware STORE Cycle 22 Figure 13 Soft Sequence Processing 20 21 Switching Waveforms continued tRC tRC ADDRESS 1 ADDRESS 6 ADDRESS tAS tCW tGHAX tSTORE tRECALL DATA VALID DATA VALID HIGH IMPEDANCE CE OE DQ DATA a a a a a a a a a a a a a a tSS tSS Feedback ...

Page 15: ...BA15XI 51 85128 48 ball FBGA CY14E102N ZSP15XCT 51 85160 54 pin TSOP II Commercial CY14E102N ZSP15XIT 51 85160 54 pin TSOP II Industrial CY14E102N ZSP15XI 51 85160 54 pin TSOP II 20 CY14B102L ZS20XCT 51 85087 44 pin TSOP II Commercial CY14E102L ZS20XIT 51 85087 44 pin TSOP II Industrial CY14E102L ZS20XI 51 85087 44 pin TSOP II CY14E102L BA20XCT 51 85128 48 ball FBGA Commercial CY14E102L BA20XIT 51...

Page 16: ...SOP II 45 CY14E102L ZS45XCT 51 85087 44 pin TSOP II Commercial CY14E102L ZS45XIT 51 85087 44 pin TSOP II Industrial CY14E102L ZS45XI 51 85087 44 pin TSOP II CY14E102L BA45XCT 51 85128 48 ball FBGA Commercial CY14E102L BA45XIT 51 85128 48 ball FBGA Industrial CY14E102L BA45XI 51 85128 48 ball FBGA CY14E102L ZSP45XCT 51 85160 54 pin TSOP II Commercial CY14E102L ZSP45XIT 51 85160 54 pin TSOP II Indus...

Page 17: ...l Blank Std Speed 20 20 ns 25 25 ns Data Bus L x8 N x16 Density 102 2 Mb Voltage E 5 0V Cypress NVSRAM 14 Auto Store Software Store Hardware Store Temperature C Commercial 0 to 70 C I Industrial 40 to 85 C Pb Free Package BA 48 FBGA ZS TSOP II P 54 Pin Blank 44 Pin 45 45 ns CY 14 E 102 L ZS P 15 X C T 15 15 ns Feedback ...

Page 18: ...LANE SEATING PIN 1 I D 44 1 18 517 0 729 0 800 BSC 0 5 0 400 0 016 0 300 0 012 EJECTOR PIN R G O K E A X S 11 735 0 462 10 058 0 396 10 262 0 404 1 194 0 047 0 991 0 039 0 150 0 0059 0 050 0 0020 0 0315 18 313 0 721 10 058 0 396 10 262 0 404 0 597 0 0235 0 406 0 0160 0 210 0 0083 0 120 0 0047 BASE PLANE 0 10 004 22 23 TOP VIEW BOTTOM VIEW 51 85087 A Feedback ...

Page 19: ...Diagrams continued A 1 A1 CORNER 0 75 0 75 Ø0 30 0 05 48X Ø0 25 M C A B Ø0 05 M C B A 0 15 4X 0 21 0 05 1 20 MAX C SEATING PLANE 0 53 0 05 0 25 C 0 15 C A1 CORNER TOP VIEW BOTTOM VIEW 2 3 4 3 75 5 25 B C D E F G H 6 5 4 6 5 2 3 1 D H F G E C B A 6 00 0 10 10 00 0 10 A 10 00 0 10 6 00 0 10 B 1 875 2 625 0 36 51 85128 D Feedback ...

Page 20: ...ADVANCE CY14E102L CY14E102N Document Number 001 45755 Rev A Page 20 of 21 Figure 16 54 Pin TSOP II Package Diagrams continued 51 85160 Feedback ...

Page 21: ... CYPRESS MAKES NO WARRANTY OF ANY KIND EXPRESS OR IMPLIED WITH REGARD TO THIS MATERIAL INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE Cypress reserves the right to make changes without further notice to the materials described herein Cypress does not assume any liability arising out of the application or use of any product or circuit des...

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