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PRELIMINARY

CY14B101Q1
CY14B101Q2
CY14B101Q3

Document #: 001-50091 Rev. *A

Page 3 of 22

Device Operation 

CY14B101Q1/CY14B101Q2/CY14B101Q3 is 1 Mbit nvSRAM

memory with a nonvolatile element in each memory cell. All the

reads and writes to nvSRAM happen to the SRAM which gives

nvSRAM the unique capability to handle infinite writes to the

memory. The data in SRAM is secured by a STORE sequence

which transfers the data in parallel to the nonvolatile Quantum

Trap cells. A small capacitor (V

CAP

) is used to AutoStore the

SRAM data in nonvolatile cells when power goes down providing

power down data security. The Quantum Trap nonvolatile

elements built in the reliable SONOS technology make nvSRAM

the ideal choice for secure data storage. 
The 1 Mbit memory array is organized as 128K words x 8 bits.

The memory can be accessed through a standard SPI interface

that enables very high clock speeds upto 40 MHz with zero cycle

delay read and write cycles. This device supports SPI modes 0

and 3 (CPOL, CPHA = 0, 0 & 1, 1) and operates as SPI slave.

The device is enabled using the Chip Select pin (CS) and

accessed through Serial Input (SI), Serial Output (SO), and

Serial Clock (SCK) pins. 
This device provides the feature for hardware and software write

protection through WP pin and WRDI instruction respectively

along with mechanisms for block write protection (1/4, 1/2, or full

array) using BP0 and BP1 pins in the status register. Further, the

HOLD pin can be used to suspend any serial communication

without resetting the serial sequence. 
CY14B101Q1/CY14B101Q2/CY14B101Q3 uses the standard

SPI opcodes for memory access. In addition to the general SPI

instructions for read and write, it provides four special

instructions which enable access to four nvSRAM specific

functions: STORE, RECALL, AutoStore Disable (ASDISB), and

AutoStore Enable (ASENB). 
The major benefit of nvSRAM SPI over serial EEPROMs is that

all reads and writes to nvSRAM are performed at the speed of

SPI bus with zero delay. Therefore, no wait time is required after

any of the memory accesses. The STORE and RECALL

operations need finite time to complete and all memory accesses

are inhibited during this time. While a STORE or RECALL

operation is in progress, the busy status of the device is indicated

by the Hardware STORE Busy (HSB) pin and also reflected on

the RDY bit of the Status Register.
The Device is available in three different pin configurations that

enable the user to choose a part which fits in best in their appli-

cation

The Feature summary is given in 

Table 2

.

SRAM Write

All writes to nvSRAM are carried out on the SRAM and do not

use up any endurance cycles of the nonvolatile memory. This

enables user to perform

 

infinite write operations. A Write cycle is

performed through the SPI WRITE instruction. The WRITE

instruction is issued through the SI pin of the nvSRAM and

consists of the WRITE opcode, three bytes of address, and one

byte of data. Write to nvSRAM is done at SPI bus speed with zero

cycle delay. 
The device allows burst mode writes to be performed through

SPI. This enables write operations on consecutive addresses

without issuing a new WRITE instruction. When the last address

in memory is reached, the address rolls over to 0x0000 and the

device continues to write. 
The SPI write cycle sequence is defined explicitly in the Memory

Access section of SPI Protocol Description.

SRAM Read

A read cycle is performed at the SPI bus speed and the data is

read out with zero cycle delay after the READ instruction is

performed. The READ instruction is issued through the SI pin of

the nvSRAM and consists of the READ opcode and 3 bytes of

address. The data is read out on the SO pin. 
This device allows burst mode reads to be performed through

SPI. This enables reads on consecutive addresses without

issuing a new READ instruction. When the last address in

memory is reached in burst mode read, the address rolls over to

0x0000 and the device continues to read. 
The SPI read cycle sequence is defined explicitly in the Memory

Access section of SPI Protocol Description.

STORE Operation

STORE operation transfers the data from the SRAM to the

nonvolatile Quantum Trap cells. The device stores data to the

nonvolatile cells using one of three STORE operations:

AutoStore, activated on device power down; Software STORE,

activated by a STORE instruction in the SPI; Hardware STORE,

activated by the HSB. During the STORE cycle, an erase of the

previous nonvolatile data is first performed, followed by a

program of the nonvolatile elements. After a STORE cycle is

initiated, further input and output are disabled until the cycle is

completed.
The HSB signal or the RDY bit in the Status register can be

monitored by the system to detect if a STORE cycle is in

progress. The busy status of nvSRAM is indicated by HSB being

pulled LOW or RDY bit being set to ‘1’. To avoid unnecessary

nonvolatile STOREs, AutoStore and Hardware STORE opera-

tions are ignored unless at least one write operation has taken

place since the most recent STORE or RECALL cycle. Software

initiated STORE cycles are performed regardless of whether a

write operation has taken place.

AutoStore Operation

The AutoStore operation is a unique feature of nvSRAM which

automatically stores the SRAM data to QuantumTrap during

power down. This Store mechanism is implemented using a

Table 2.   Feature Summary

Feature

CY14B101Q1

CY14B101Q2

CY14B101Q3

WP

Yes

No

Yes

V

CAP

No

Yes

Yes

HSB

No

No

Yes

AutoStore

No

Yes

Yes

Power Up 

RECALL

Yes

Yes

Yes

Hardware 

STORE

No

No

Yes

Software 

STORE

Yes

Yes

Yes

[+] Feedback 

Summary of Contents for CY14B101Q1

Page 1: ...t of 10 mA at 40 MHz operation Industry Standard Configurations Commercial and industrial temperatures CY14B101Q1 has identical pin configuration to industry stan dard 8 pin NV Memory 8 pin DFN and 16 pin SOIC Packages RoHS compliant Functional Overview The Cypress CY14B101Q1 CY14B101Q2 CY14B101Q3 combines a 1 Mbit nonvolatile static RAM with a nonvolatile element in each memory cell The memory is...

Page 2: ...ternal pull up keeps this pin pulled high If not used this pin is left as No Connect Output Indicates busy status of nvSRAM when LOW Input Hardware STORE implemented by pulling this pin LOW externally VCAP Power Supply AutoStore Capacitor Supplies power to the nvSRAM during power loss to STORE data from the SRAM to nonvolatile elements If AutoStore is not needed this pin must be left as No Connect...

Page 3: ...ser to perform infinite write operations A Write cycle is performed through the SPI WRITE instruction The WRITE instruction is issued through the SI pin of the nvSRAM and consists of the WRITE opcode three bytes of address and one byte of data Write to nvSRAM is done at SPI bus speed with zero cycle delay The device allows burst mode writes to be performed through SPI This enables write operations...

Page 4: ...uration or as long as HSB pin is LOW The HSB pin also acts as an open drain driver that is internally driven LOW to indicate a busy condition when a STORE cycle initiated by any means or Power up RECALL is in progress Upon completion of the STORE operation the nvSRAM remains disabled until the HSB pin returns HIGH Leave the HSB pin unconnected if not used Note CY14B101Q1 CY14B101Q2 do not have HSB...

Page 5: ...CS For selecting any slave device the master needs to pull down the corresponding CS pin Any instruction can be issued to a slave device only while the CS pin is LOW When the device is not selected data through the SI pin is ignored and the serial output pin SO remains in a high impedance state Note A new instruction must begin with the falling edge of Chip Select CS Therefore only one opcode can ...

Page 6: ...n in Figure 5 and Figure 6 The status of clock when the bus master is in Standby mode and not transferring data is SCK remains at 0 for Mode 0 SCK remains at 1 for Mode 3 CPOL and CPHA bits must be set in the SPI controller for either Mode 0 or Mode 3 The device detects the SPI mode from the status of SCK pin when the device is selected by bringing the CS pin LOW If SCK pin is LOW when device is s...

Page 7: ...accesses are inhibited and a conditional AutoStore operation is performed AutoStore is not performed if no writes have happened since last RECALL cycle This feature prevents inadvertent writes to nvSRAM from happening during power down However to completely avoid the possibility of inadvertent writes during power down ensure that the device is deselected and is in Standby Power Mode and the Chip S...

Page 8: ...g the WREN instruction before it is issued The instruction is issued after the falling edge of CS using the opcode for WRSR followed by 8 bits of data to be stored in the Status Register Since only bits 2 3 and 7 can be modified by WRSR instruction it is recommended to leave the other bits as 0 while writing to the Status Register Note In CY14B101Q1 CY14B101Q2 CY14B101Q3 the values written to Stat...

Page 9: ...ecial instruction STORE RECALL ASENB and ASDISB instruction WEN bit is cleared to 0 This is done to provide protection from any inadvertent writes Therefore WREN instruction needs to be used before a new write instruction is issued Write Disable WRDI Instruction Write Disable instruction disables the write by clearing the WEN bit to 0 in order to protect the device against inadvertent writes This ...

Page 10: ...er the last address bit is ignored CY14B101Q1 CY14B101Q2 CY14B101Q3 allows reads to be performed in bursts through SPI which can be used to read consecutive addresses without issuing a new READ instruction If only one byte is to be read the CS line must be driven HIGH after one byte of data comes out However the read sequence may be continued by holding the CS line LOW and the address is automatic...

Page 11: ...ng Figure 14 Burst Mode Write Instruction Timing CS SCK SO LSB SI Op Code 17 bit Address MSB LSB 0 1 2 3 4 5 6 7 0 7 6 5 4 3 2 1 20 21 22 23 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 7 0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 A16 A3 A2 A1 A0 D0 D1 D2 D3 D4 D5 D6 D7 Data Byte 1 Data Byte N MSB LSB MSB D0 D1 D2 D3 D4 D5 D6 D7 D0 D7 CS SCK SO 0 1 2 3 4 5 6 7 0 7 6 5 4 3 2 1 20 21 22 23 0 1 2 3 4 5 6 7 MSB LSB Data D0 D...

Page 12: ...the positive edge of CS following the ASENB instruction Note If ASDISB and ASENB instructions are executed in CY14B101Q1 the device is busy for the duration of software sequence processing time tSS However ASDISB and ASENB instructions have no effect on CY14B101Q1 as AutoStore is internally disabled HOLD Pin Operation The HOLD pin is used to pause the serial communication When the device is select...

Page 13: ...7V to 3 6V Industrial 40 C to 85 C 2 7V to 3 6V DC Electrical Characteristics Over the Operating Range VCC 2 7V to 3 6V Parameter Description Test Conditions Min Max Unit ICC1 Average Vcc Current At fSCK 40 MHz 10 mA ICC2 Average VCC Current during STORE All Inputs Don t Care VCC Max Average current for duration tSTORE 10 mA ICC4 Average VCAP Current during AutoStore Cycle All Inputs Don t Care VC...

Page 14: ...Test Conditions Max Unit CIN Input Capacitance TA 25 C f 1MHz VCC 3 0V 6 pF COUT Output Pin Capacitance 8 pF Thermal Resistance Parameter 6 Description Test Conditions 8 SOIC 8 DFN Unit ΘJA Thermal Resistance Junction to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance per EIA JESD51 TBD TBD C W ΘJC Thermal Resistance Junction to Case TBD TBD C W ...

Page 15: ...S CS Setup Time 10 ns tCSH tCEH CS Hold Time 10 ns tSD tSU Data In Setup Time 5 ns tHD tH Data In Hold Time 5 ns tHH tHD HOLD Hold Time 5 ns tSH tCD HOLD Setup Time 5 ns tCO tV Output Valid 9 ns tHHZ tHZ HOLD to Output High Z 15 ns tHLZ tLZ HOLD to Output Low Z 15 ns tOH tHO Output Hold Time 0 ns tHZCS tDIS Output Disable Time 25 ns Figure 21 Synchronous Data Timing Mode 0 Figure 22 HOLD Timing HI...

Page 16: ...tHHHD tDELAY tDELAY VVCCRISE Note8 Note8 Note11 tLZHSB tLZHSB tFA tFA VSWITCH VHDIS HSB OUT Autostore POWER UP RECALL Read and Write Inhibited RWI POWER UP RECALL POWER UP RECALL Read and Write Read and Write BROWN OUT AUTOSTORE POWER DOWN AUTOSTORE Notes 7 tFA starts from the time VCC rises above VSWITCH 8 If an SRAM write has not taken place since the last nonvolatile cycle AutoStore or Hardware...

Page 17: ...e 24 Software STORE Cycle 12 Figure 25 Software RECALL Cycle 12 0 0 1 1 1 1 0 0 CS SCK SI RWI Hi Z 0 1 2 3 4 5 6 7 RDY tSTORE 0 1 1 0 0 0 0 0 CS SCK SI 0 1 2 3 4 5 6 7 RWI Hi Z RDY tRECALL Notes 12 This is the amount of time it takes to take action on a soft sequence command Vcc power must remain HIGH to effectively register command 13 Commands such as STORE and RECALL lock out IO until operation ...

Page 18: ...ite latch not set 25 ns tPHSB Hardware STORE Pulse Width 15 ns Switching Waveforms Figure 26 Hardware STORE Cycle 8 HSB IN HSB OUT SO RWI HSB IN HSB OUT RWI tHHHD tSTORE tPHSB tDELAY tLZHSB tDELAY tDHSB tDHSB tPHSB HSB pin is driven high to VCC only by Internal 100K resistor HSB driver is disabled SRAM is disabled as long as HSB IN is driven LOW Write Latch not set Write Latch set Feedback ...

Page 19: ...l CY14B101Q2 LHXC 001 50671 8 DFN with VCAP CY14B101Q3 SFXIT 51 85022 16 SOIC Industrial CY14B101Q3 SFXI 51 85022 16 SOIC CY14B101Q3 SFXCT 51 85022 16 SOIC Commercial CY14B101Q3 SFXC 51 85022 16 SOIC All the above parts are Pb free The above table contains advance information Contact your local Cypress sales representative for availability of these parts Part Numbering Nomenclature Option T Tape R...

Page 20: ...1Q3 Document 001 50091 Rev A Page 20 of 22 Package Diagrams Figure 27 8 Pin 300 mil DFN Package 001 50671 1 ALL DIMENSIONS ARE IN MILLIMETERS 3 BASED ON REF JEDEC MO 240 EXCEPT DIMENSIONS L and b NOTES 2 PACKAGE WEIGHT TBD 001 50671 A Feedback ...

Page 21: ...PRELIMINARY CY14B101Q1 CY14B101Q2 CY14B101Q3 Document 001 50091 Rev A Page 21 of 22 Figure 28 16 Pin 300 mil SOIC 51 85022 Package Diagrams continued 51 85022 B Feedback ...

Page 22: ...nges without further notice to the materials described herein Cypress does not assume any liability arising out of the application or use of any product or circuit described herein Cypress does not authorize its products for use as critical components in life support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user The inclusion of Cypre...

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