CY62148BN MoBL
®
Document #: 001-06517 Rev. *A
Page 8 of 10
Package Diagrams
0.546[13.868]
0.440[11.176]
0.101[2.565]
0.050[1.270]
0.014[0.355]
0.118[2.997]
0.004[0.102]
0.047[1.193]
0.006[0.152]
0.023[0.584]
0.793[20.142]
0.450[11.430]
0.566[14.376]
0.111[2.819]
0.817[20.751]
BSC.
0.020[0.508]
MIN.
MAX.
0.012[0.304]
0.039[0.990]
0.063[1.600]
SEATING PLANE
32 LD (450 Mil) SOIC
1
16
17
32
0.004[0.102]
DIMENSIONS IN INCHES[MM]
MIN.
MAX.
PACKAGE WEIGHT 1.42gms
PART #
S32.45 STANDARD PKG.
SZ32.45 LEAD FREE PKG.
51-85081-*B
32-lead (450-Mil) Molded SOIC (51-85081)
32-Lead Thin Small Outline Package Type II (51-85095)
51-85095 **
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