CY8C24123
CY8C24223, CY8C24423
Document Number: 38-12011 Rev. *G
Page 41 of 43
Figure 27. 32-Pin (5x5 mm) MLF
Thermal Impedances
Capacitance on Crystal Pins
51-85188 *B
Table 36. Thermal Impedances per Package
Package
Typical
θ
JA
*
8 PDIP
123
o
C/W
8 SOIC
185
o
C/W
20 PDIP
109
o
C/W
20 SSOP
117
o
C/W
20 SOIC
81
o
C/W
28 PDIP
69
o
C/W
28 SSOP
101
o
C/W
28 SOIC
74
o
C/W
32 MLF
22
o
C/W
* T
J
= T
A
+ POWER x
θ
JA
Table 37. Typical Package Capacitance on Crystal Pins
Package
Package Capacitance
8 PDIP
2.8 pF
8 SOIC
2.0 pF
20 PDIP
3.0 pF
20 SSOP
2.6 pF
20 SOIC
2.5 pF
28 PDIP
3.5 pF
28 SSOP
2.8 pF
28 SOIC
2.7 pF
32 MLF
2.0 pF
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