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CY7C1381D, CY7C1381F

CY7C1383D, CY7C1383F

Document #: 38-05544 Rev. *F

Page 7 of 29

Functional Overview

All synchronous inputs pass through input registers controlled
by the rising edge of the clock. Maximum access delay from
the clock rise (t

CDV

) is 6.5 ns (133 MHz device). 

The CY7C1381D/CY7C1383D/CY7C1381F/CY7C1383F
supports secondary cache in systems utilizing a linear or
interleaved burst sequence. The interleaved burst order
supports Pentium

®

 and i486™ processors. The linear burst

sequence is suited for processors that utilize a linear burst
sequence. The burst order is user selectable, and is
determined by sampling the MODE input. Accesses can be
initiated with the processor address strobe (ADSP) or the
controller address strobe (ADSC). Address advancement
through the burst sequence is controlled by the ADV input. A
two-bit on-chip wraparound burst counter captures the first
address in a burst sequence and automatically increments the
address for the rest of the burst access.
Byte write operations are qualified with the byte write enable
(BW

E

) and byte write select (BW

X

) inputs. A global write

enable (GW) overrides all byte write inputs and writes data to
all four bytes. All writes are simplified with on-chip
synchronous self-timed write circuitry.
Three synchronous chip selects (CE

1

, CE

2

, CE

[2]

) and an

asynchronous output enable (OE) provide for easy bank

selection and output tri-state control. ADSP is ignored if CE

1

is HIGH.

Single Read Accesses

A single read access is initiated when the following conditions
are satisfied at clock rise: (1) CE

1

, CE

2

, and CE

[2]

 are all

asserted active, and (2) ADSP or ADSC is asserted LOW (if
the access is initiated by ADSC, the write inputs must be
deasserted during this first cycle). The address presented to
the address inputs is latched into the address register and the
burst counter and/or control logic, and later presented to the
memory core. If the OE input is asserted LOW, the requested
data will be available at the data outputs with a maximum to
t

CDV

 after clock rise. ADSP is ignored if CE

1

 is HIGH.

Single Write Accesses Initiated by ADSP

This access is initiated when the following conditions are
satisfied at clock rise: (1) CE

1

, CE

2

, CE

[2]

 are all asserted

active, and (2) ADSP is asserted LOW. The addresses
presented are loaded into the address register and the burst
inputs (GW, BW

E

, and BW

X

) are ignored during this first clock

cycle. If the write inputs are asserted active (see 

Truth Table

for Read/Write 

[4, 9]

 on page 10

 for appropriate states that

indicate a write) on the next clock rise, the appropriate data will
be latched and written into the device. Byte writes are allowed.
All IOs are tri-stated during a byte write. As this is a common
IO device, the asynchronous OE input signal must be

MODE

Input-Static

Selects burst order

. When tied to GND selects linear burst sequence. When tied to V

DD

or left floating selects interleaved burst sequence. This is a strap pin and must remain static
during device operation. Mode pin has an internal pull up.

V

DD

Power Supply 

Power supply inputs to the core of the device

V

DDQ

IO Power Supply

Power supply for the IO circuitry

V

SS

Ground

Ground for the core of the device

V

SSQ

IO Ground

Ground for the IO circuitry

TDO

JTAG serial output

Synchronous

Serial data-out to the JTAG circuit

. Delivers data on the negative edge of TCK. If the

JTAG feature is not being utilized, this pin can be left unconnected. This pin is not available
on TQFP packages.

TDI

JTAG serial input

Synchronous

Serial data-in to the JTAG circuit

. Sampled on the rising edge of TCK. If the JTAG feature

is not being utilized, this pin can be left floating or connected to V

DD 

through a pull up

resistor. This pin is not available on TQFP packages.

TMS

JTAG serial input

Synchronous

Serial data-in to the JTAG circuit

. Sampled on the rising edge of TCK. If the JTAG feature

is not being utilized, this pin can be disconnected or connected to V

DD

. This pin is not

available on TQFP packages.

TCK

JTAG-

Clock

Clock input to the JTAG circuitry

. If the JTAG feature is not being utilized, this pin must

be connected to V

SS

. This pin is not available on TQFP packages.

NC

No connects

. Not internally connected to the die. 36M, 72M, 144M, 288M, 576M, and 1G

are address expansion pins and are not internally connected to the die.

V

SS

/DNU

Ground/DNU

This pin can be connected to ground or can be left floating.

Pin Definitions

 (continued)

Name

IO

Description

[+] Feedback 

Summary of Contents for CY7C1381D

Page 1: ...y a positive edge triggered clock input CLK The synchronous inputs include all addresses all data inputs address pipelining chip enable CE1 depth expansion chip enables CE2 and CE3 2 burst control inp...

Page 2: ...E CE1 CE2 CE3 OE GW SLEEP DQA DQP A BYTE WRITE REGISTER DQB DQP B WRITE REGISTER DQC DQP C WRITE REGISTER BYTE WRITE REGISTER DQD DQP D BYTE WRITE REGISTER DQD DQP D BYTE WRITE REGISTER DQC DQP C WRIT...

Page 3: ...5 64 63 62 61 60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 MODE CY7C1381D 512K x 36 VSS DNU A A A A A 1 A 0 NC NC V SS V DD A A A A A A A A A NC NC VDDQ V...

Page 4: ...VDD DQD DQD DQD DQD ADSC NC CE1 OE ADV GW VSS VSS VSS VSS VSS VSS VSS VSS DQPA MODE DQPD DQPB BWB BWC NC VDD NC BWA NC BWE BWD ZZ 2 3 4 5 6 7 1 A B C D E F G H J K L M N P R T U VDDQ NC 288M NC 144M...

Page 5: ...DQB DQB NC DQB NC DQA DQA VDD VDDQ VDD VDDQ DQB VDD NC VDD DQA VDD VDDQ DQA VDDQ VDD VDD VDDQ VDD VDDQ DQA VDDQ A A VSS A A A DQB DQB DQB ZZ DQA DQA DQPA DQA A VDDQ A CY7C1383D 1M x 18 A0 A VSS 2 3 4...

Page 6: ...m a deselected state ADV Input Synchronous Advance input signal Sampled on the rising edge of CLK When asserted it automatically increments the address in a burst cycle ADSP Input Synchronous Address...

Page 7: ...initiated when the following conditions are satisfied at clock rise 1 CE1 CE2 CE3 2 are all asserted active and 2 ADSP is asserted LOW The addresses presented are loaded into the address register and...

Page 8: ...can follow either a linear or interleaved burst order The burst order is determined by the state of the MODE input A LOW on MODE will select a linear burst sequence A HIGH on MODE will select an inte...

Page 9: ...H D Write Cycle Continue Burst Next H X X L X H L L X L H D Read Cycle Suspend Burst Current X X X L H H H H L L H Q Read Cycle Suspend Burst Current X X X L H H H H H L H Tri State Read Cycle Suspen...

Page 10: ...D A DQD DQA DQPD DQPA H L L H H L Write Bytes D B DQD DQA DQPD DQPA H L L H L H Write Bytes D B A DQD DQB DQA DQPD DQPB DQPA H L L H L L Write Bytes D B DQD DQB DQPD DQPB H L L L H H Write Bytes D B A...

Page 11: ...MSB of any register See TAP Controller Block Diagram Test Data Out TDO The TDO output ball is used to serially clock data out from the registers The output is active depending upon the current state...

Page 12: ...aded into the instruction register upon power up or whenever the TAP controller is given a test logic reset state SAMPLE Z The SAMPLE Z instruction causes the boundary scan register to be connected be...

Page 13: ...ed but are reserved for future use Do not use these instructions TAP Timing TAP AC Switching Characteristics Over the Operating Range 10 11 Parameter Description Min Max Unit Clock tTCYC TCK Clock Cyc...

Page 14: ...uivalent TDO 1 5V 20pF Z 50 O 50 TDO 1 25V 20pF Z 50 O 50 TAP DC Electrical Characteristics And Operating Conditions 0 C TA 70 C VDD 3 3V 0 165V unless otherwise noted 12 Parameter Description Conditi...

Page 15: ...can Order 165 ball fBGA package 89 89 Identification Codes Instruction Code Description EXTEST 000 Captures Input Output ring contents Places the boundary scan register between TDI and TDO Forces all...

Page 16: ...L5 28 E6 50 B3 72 L2 7 R6 29 D6 51 A3 73 N2 8 U6 30 C7 52 C2 74 P2 9 R7 31 B7 53 A2 75 R3 10 T7 32 C6 54 B1 76 T1 11 P6 33 A6 55 C1 77 R1 12 N7 34 C5 56 D2 78 T2 13 M6 35 B5 57 E1 79 L3 14 L7 36 G5 5...

Page 17: ...H3 8 P9 38 B9 68 J1 9 P10 39 C10 69 K1 10 R10 40 A8 70 L1 11 R11 41 B8 71 M1 12 H11 42 A7 72 J2 13 N11 43 B7 73 K2 14 M11 44 B6 74 L2 15 L11 45 A6 75 M2 16 K11 46 B5 76 N1 17 J11 47 A5 77 N2 18 M10 48...

Page 18: ...ge 17 for 3 3V IO 2 0 VDD 0 3V V for 2 5V IO 1 7 VDD 0 3V V VIL Input LOW Voltage 17 for 3 3V IO 0 3 0 8 V for 2 5V IO 0 3 0 7 V IX Input Leakage Current except ZZ and MODE GND VI VDDQ 5 5 A Input Cur...

Page 19: ...ce Junction to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance in accordance with EIA JESD51 28 66 23 8 20 7 C W JC Thermal Resistance Junction to C...

Page 20: ...5 0 5 ns tADH ADSP ADSC Hold After CLK Rise 0 5 0 5 ns tWEH GW BWE BW A D Hold After CLK Rise 0 5 0 5 ns tADVH ADV Hold After CLK Rise 0 5 0 5 ns tDH Data Input Hold After CLK Rise 0 5 0 5 ns tCEH Ch...

Page 21: ...DV tOEHZ tCDV SingleREAD BURST READ tOEV tOELZ tCHZ Burstwrapsaround toitsinitialstate t ADVH t ADVS t WEH t WES tADH tADS Q A2 Q A2 1 Q A2 2 Q A1 Q A2 Q A2 1 Q A2 2 Q A2 3 A2 ADVsuspendsburst Deselec...

Page 22: ...D A1 D A3 D A3 1 D A3 2 D A2 3 A2 A3 Extended BURST WRITE D A2 2 Single WRITE tADH tADS tADH tADS t OEHZ tADVH tADVS tWEH tWES t DH t DS t WEH t WES Byte write signals are ignored for rst cycle when...

Page 23: ...CES Single WRITE D A3 A3 A4 BURST READ Back to Back READs High Z Q A2 Q A4 Q A4 1 Q A4 2 Q A4 3 t WEH t WES t OEHZ tDH tDS tCDV tOELZ A1 A5 A6 D A5 D A6 Q A1 Back to Back WRITEs DON T CARE UNDEFINED A...

Page 24: ...ZZ I SUPPLY CLK ZZ t ZZREC ALL INPUTS except ZZ DON T CARE I DDZZ t ZZI tRZZI Outputs Q High Z DESELECT or READ Only Notes 30 Device must be deselected when entering ZZ mode See Truth Table 4 5 6 7 8...

Page 25: ...ball Ball Grid Array 14 x 22 x 2 4 mm Pb Free CY7C1383F 133BGXI CY7C1381D 133BZI 51 85180 165 ball Fine Pitch Ball Grid Array 13 x 15 x 1 4 mm CY7C1383D 133BZI CY7C1381D 133BZXI 51 85180 165 ball Fin...

Page 26: ...TRUSION END FLASH SHALL NOT EXCEED 0 0098 in 0 25 mm PER SIDE 3 DIMENSIONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0 20...

Page 27: ...CY7C1381D CY7C1381F CY7C1383D CY7C1383F Document 38 05544 Rev F Page 27 of 29 Figure 2 119 ball BGA 14 x 22 x 2 4 mm 51 85115 Package Diagrams continued 51 85115 B Feedback...

Page 28: ...a trademark of Intel Corporation All product and company names mentioned in this document are the trademarks of their respective holders Figure 3 165 ball FBGA 13 x 15 x 1 4 mm 51 85180 Package Diagr...

Page 29: ...nd 6 2 C W respectively Changed JA and JC for FBGA Package from 46 and 3 C W to 20 7 and 4 0 C W respectively Modified VOL VOH test conditions Removed comment of Pb free BG packages availability below...

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