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9-Mbit (256K x 32) Flow-Through Sync SRAM

CY7C1365C

Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document #: 38-05690 Rev. *E

 Revised September 14, 2006

Features

• 256K x 32 common I/O

• 3.3V core power supply (V

DD

)

• 2.5V/3.3V I/O power supply (V

DDQ

)

• Fast clock-to-output times

— 6.5 ns (133-MHz version)

• Provide high-performance 2-1-1-1 access rate

• User-selectable burst counter supporting Intel

®

 

Pentium

®

 interleaved or linear burst sequences

• Separate processor and controller address strobes 

• Synchronous self-timed write

• Asynchronous output enable

• Supports 3.3V I/O level 

• Available in JEDEC-standard lead-free 100-Pin TQFP 

package

• TQFP Available with 3-Chip Enable and 2-Chip Enable

• “ZZ” Sleep Mode option

Functional Description

[1]

The CY7C1365C is a 256K x 32 synchronous cache RAM
designed to interface with high-speed microprocessors with
minimum glue logic. Maximum access delay from clock rise is
6.5 ns (133-MHz version). A 2-bit on-chip counter captures the
first address in a burst and increments the address automati-
cally for the rest of the burst access. All synchronous inputs
are gated by registers controlled by a positive-edge-triggered
Clock Input (CLK). The synchronous inputs include all
addresses, all data inputs, address-pipelining Chip Enable
(CE

1

), depth-expansion Chip Enables (CE

2

 and

 

CE

3

[2]

), Burst

Control inputs (ADSC, ADSP, and ADV), Write Enables
(BW[A:D], and BWE), and Global Write (GW). Asynchronous
inputs include the Output Enable (OE) and the ZZ pin.

The CY7C1365C allows either interleaved or linear burst
sequences, selected by the MODE input pin. A HIGH selects
an interleaved burst sequence, while a LOW selects a linear
burst sequence. Burst accesses can be initiated with the
Processor Address Strobe (ADSP) or the cache Controller
Address Strobe (ADSC) inputs. Address advancement is
controlled by the Address Advancement (ADV) input.

Addresses and Chip Enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).

The CY7C1365C operates from a +3.3V core power supply
while all outputs may operate with either a +2.5 or +3.3V
supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.

 

Notes: 

1. For best-practices recommendations, please refer to the Cypress application note 

System Design Guidelines 

on www.cypress.com.

2. CE

3

 is not available on 2 Chip Enable TQFP package.

Selection Guide

133 MHz

100 MHz

Unit

Maximum Access Time 

6.5

8.5

ns

Maximum Operating Current 

250

180

mA

Maximum Standby Current 

40

40

mA

[+] Feedback 

Summary of Contents for CY7C1365C

Page 1: ...ts include all addresses all data inputs address pipelining Chip Enable CE1 depth expansion Chip Enables CE2 and CE3 2 Burst Control inputs ADSC ADSP and ADV Write Enables BW A D and BWE and Global Wr...

Page 2: ...ARRAY MODE A 1 0 ZZ DQs A0 A1 A ADV CLK ADSP ADSC BWD BWC BWB BWA BWE CE1 CE2 CE3 OE GW SLEEP CONTROL DQA BYTE WRITE REGISTER DQB BYTE WRITE REGISTER DQC BYTE WRITE REGISTER BYTE WRITE REGISTER DQD BY...

Page 3: ...DDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSSQ DQD DQD DQD DQD VSSQ VDDQ DQD DQD NC A A CE 1 CE 2 BWS D BWS C BWS B BWS A A V DD V SS CLK GW BWE OE ADSP A A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1...

Page 4: ...VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSSQ DQD DQD DQD DQD VSSQ VDDQ DQD DQD NC A A CE 1 CE 2 BWS D BWS C BWS B BWS A CE 3 V DD V SS CLK GW BWE OE ADSP A A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17...

Page 5: ...throughout this document for BGA CE3 is sampled only when a new external address is loaded OE 86 Input Asynchronous Output Enable asynchronous input active LOW Controls the direction of the I O pins...

Page 6: ...60 71 76 I O Ground Ground for the I O circuitry MODE 31 Input Static Selects Burst Order When tied to GND selects linear burst sequence When tied to VDD or left floating selects interleaved burst seq...

Page 7: ...te writes BWA controls DQA and BWB controls DQB BWC controls DQC and BWD controls DQD All I Os are tri stated during a byte write Since this is a common I O device the asynchronous OE input signal mus...

Page 8: ...Burst Next H X X L X H L H L L H Q Read Cycle Continue Burst Next H X X L X H L H H L H Tri State Write Cycle Continue Burst Next X X X L H H L L X L H D Write Cycle Continue Burst Next H X X L X H L...

Page 9: ...H H Write Bytes C A DQPC DQPA H L H L H L Write Bytes C B DQPC DQPB H L H L L H Write Bytes C B A DQPC DQPB DQPA H L H L L L Write Byte D DQPD H L L H H H Write Bytes D A DQPD DQPA H L L H H L Write B...

Page 10: ...IH Input HIGH Voltage for 3 3V I O 2 0 VDD 0 3V V for 2 5V I O 1 7 VDD 0 3V V VIL Input LOW Voltage 8 for 3 3V I O 0 3 0 8 V for 2 5V I O 0 3 0 7 V IX Input Leakage Current except ZZ and MODE GND VI V...

Page 11: ...ollow standard test methods and procedures for measuring thermal impedance per EIA JESD51 29 41 C W JC Thermal Resistance Junction to Case 6 13 C W AC Test Loads and Waveforms OUTPUT R 317 R 351 5 pF...

Page 12: ...s tADH ADSP ADSC Hold after CLK Rise 0 5 0 5 ns tWEH GW BWE BW A D Hold after CLK Rise 0 5 0 5 ns tADVH ADV Hold after CLK Rise 0 5 0 5 ns tDH Data Input Hold after CLK Rise 0 5 0 5 ns tCEH Chip Enabl...

Page 13: ...CE2 is LOW or CE3 is HIGH tCYC tCL CLK tADH tADS ADDRESS t CH tAH tAS A1 tCEH tCES Data Out Q High Z tCLZ tDOH tCDV tOEHZ tCDV Single READ BURST READ tOEV tOELZ tCHZ Burst wraps around to its initial...

Page 14: ...iming Diagrams continued tCYC t CL CLK tADH tADS ADDRESS t CH tAH tAS A1 tCEH tCES High Z BURST READ BURST WRITE D A2 D A2 1 D A2 1 D A1 D A3 D A3 1 D A3 2 D A2 3 A2 A3 Extended BURST WRITE D A2 2 Sin...

Page 15: ...ed tCYC t CL CLK tADH tADS ADDRESS t CH tAH tAS A2 tCEH tCES Single WRITE D A3 A3 A4 BURST READ Back to Back READs High Z Q A2 Q A4 Q A4 1 Q A4 2 Q A4 3 t WEH t WES t OEHZ tDH tDS tCDV tOELZ A1 A5 A6...

Page 16: ...ial CY7C1365C 133AJXI 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Lead Free 2 Chip Enable 100 CY7C1365C 100AXC 51 85050 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Lead Free 3 Chip Enable Commercial...

Page 17: ...press products in life support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges Intel and Pentium are registered t...

Page 18: ...page 6 Added Industrial operating range Updated Ordering Information Table B 377095 See ECN PCI Changed ISB2 from 30 to 40 mA Modified test condition in note 9 from VIH VDD to VIH VDD C 408725 See EC...

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