Cypress Semiconductor CY7C1360C Specification Sheet Download Page 8

 

CY7C1360C
CY7C1362C

Document #: 38-05540 Rev. *H

Page 8 of 31

Functional Overview

All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock.
Maximum access delay from the clock rise (t

CO

) is 2.8 ns

(250-MHz device). 

The CY7C1360C/CY7C1362C supports secondary cache in
systems utilizing either a linear or interleaved burst sequence.
The interleaved burst order supports Pentium and i486

processors. The linear burst sequence is suited for processors
that utilize a linear burst sequence. The burst order is user
selectable, and is determined by sampling the MODE input.
Accesses can be initiated with either the Processor Address
Strobe (ADSP) or the Controller Address Strobe (ADSC).
Address advancement through the burst sequence is
controlled by the ADV input. A two-bit on-chip wraparound
burst counter captures the first address in a burst sequence
and automatically increments the address for the rest of the
burst access.

Byte Write operations are qualified with the Byte Write Enable
(BWE) and Byte Write Select (BW

X

) inputs. A Global Write

Enable (GW) overrides all Byte Write inputs and writes data to
all four bytes. All writes are simplified with on-chip
synchronous self-timed Write circuitry.

Three synchronous Chip Selects (CE

1

, CE

2

, CE

3

[2]

) and an

asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. ADSP is ignored if CE

1

is HIGH.

Single Read Accesses

This access is initiated when the following conditions are
satisfied at clock rise: (1) ADSP or ADSC is asserted LOW, (2)
CE

1

, CE

2

, CE

3

[2]

 are all asserted active, and (3) the Write

signals (GW, BWE) are all deasserted HIGH. ADSP is ignored
if CE

1

 is HIGH. The address presented to the address inputs

(A) is stored into the address advancement logic and the
address register while being presented to the memory array.
The corresponding data is allowed to propagate to the input of
the output registers. At the rising edge of the next clock the
data is allowed to propagate through the output register and
onto the data bus within 2.8 ns (250-MHz device) if OE is
active LOW. The only exception occurs when the SRAM is
emerging from a deselected state to a selected state, its
outputs are always tri-stated during the first cycle of the

access. After the first cycle of the access, the outputs are
controlled by the OE signal. Consecutive single Read cycles
are supported. Once the SRAM is deselected at clock rise by
the chip select and either ADSP or ADSC signals, its output
will tri-state immediately.

Single Write Accesses Initiated by ADSP

This access is initiated when both of the following conditions
are satisfied at clock rise: (1) ADSP is asserted LOW, and
(2) CE

1

, CE

2

, CE

3

[2]

 are all asserted active. The address

presented to A is loaded into the address register and the
address advancement logic while being delivered to the
memory array. The Write signals (GW, BWE, and BW

X

) and

ADV inputs are ignored during this first cycle. 

ADSP-triggered Write accesses require two clock cycles to
complete. If GW is asserted LOW on the second clock rise, the
data presented to the DQs inputs is written into the corre-
sponding address location in the memory array. If GW is HIGH,
then the Write operation is controlled by BWE and BW

X

signals. The CY7C1360C/CY7C1362C provides Byte Write
capability that is described in the Write Cycle Descriptions
table. Asserting the Byte Write Enable input (BWE) with the
selected Byte Write (BW

X

) input, will selectively write to only

the desired bytes. Bytes not selected during a Byte Write
operation will remain unaltered. A synchronous self-timed
Write mechanism has been provided to simplify the Write
operations.

Because the CY7C1360C/CY7C1362C is a common I/O
device, the Output Enable (OE) must be deasserted HIGH
before presenting data to the DQs inputs. Doing so will tri-state
the output drivers. As a safety precaution, DQs are automati-
cally tri-stated whenever a Write cycle is detected, regardless
of the state of OE.

Single Write Accesses Initiated by ADSC

ADSC Write accesses are initiated when the following condi-
tions are satisfied: (1) ADSC is asserted LOW, (2) ADSP is
deasserted HIGH, (3) CE

1

, CE

2

, CE

3

[2]

 are all asserted active,

and (4) the appropriate combination of the Write inputs (GW,
BWE, and BW

X

) are asserted active to conduct a Write to the

desired byte(s). ADSC-triggered Write accesses require a
single clock cycle to complete. The address presented to A is
loaded into the address register and the address
advancement logic while being delivered to the memory array.
The ADV input is ignored during this cycle. If a global Write is

TDI

JTAG serial input 

Synchronous

Serial data-In to the JTAG circuit

. Sampled on the rising edge of TCK. If the JTAG feature is 

not being utilized, this pin can be disconnected or connected to V

DD

. This pin is not available 

on TQFP packages.

TMS

JTAG serial input 

Synchronous

Serial data-In to the JTAG circuit

. Sampled on the rising edge of TCK. If the JTAG feature is 

not being utilized, this pin can be disconnected or connected to V

DD

. This pin is not available 

on TQFP packages.

TCK

JTAG-

Clock

Clock input to the JTAG circuitry

. If the JTAG feature is not being utilized, this pin must be 

connected to V

SS

. This pin is not available on TQFP packages.

NC

No Connects

. Not internally connected to the die

NC (18,36, 
72, 144, 288, 
576, 1G)

These pins are not connected

. They will be used for expansion to the 18M, 36M, 72M, 144M 

288M, 576M, and 1G densities.

Pin Definitions

  (continued)

Name

I/O

Description

[+] Feedback 

Summary of Contents for CY7C1360C

Page 1: ...2 Burst Control inputs ADSC ADSP and ADV Write Enables BWX and BWE and Global Write GW Asynchronous inputs include the Output Enable OE and the ZZ pin Addresses and chip enables are registered at ris...

Page 2: ...DSC MODE BWE GW CE1 CE2 CE3 OE ENABLE REGISTER OUTPUT REGISTERS SENSE AMPS OUTPUT BUFFERS E PIPELINED ENABLE INPUT REGISTERS A0 A1 A BWB BWC BWD BWA MEMORY ARRAY DQs DQPA DQPB DQPC DQPD SLEEP CONTROL...

Page 3: ...2 61 60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 MODE CY7C1360C 256K X 36 NC A A A A A 1 A 0 NC 72M NC 36M V SS V DD NC 18M A A A A A A A A A NC NC VDDQ...

Page 4: ...63 62 61 60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 MODE CY7C1360C 256K X 36 NC A A A A A 1 A 0 NC 72M NC 36M V SS V DD A A A A A A A A NC NC VDDQ VSSQ...

Page 5: ...C NC CE1 OE ADV GW VSS VSS VSS VSS VSS VSS VSS VSS DQPA MODE DQPD DQPB BWB BWC NC VDD NC BWA NC BWE BWD ZZ 2 3 4 5 6 7 1 A B C D E F G H J K L M N P R T U VDDQ NC 288M NC 144M NC DQB DQB DQB DQB A A A...

Page 6: ...DQB NC DQB NC DQA DQA VDD VDDQ VDD VDDQ DQB VDD NC VDD DQA VDD VDDQ DQA VDDQ VDD VDD VDDQ VDD VDDQ DQA VDDQ A A VSS A A A DQB DQB DQB ZZ DQA DQA DQPA DQA A VDDQ A CY7C1362C 512K x 18 A0 A VSS 2 3 4 5...

Page 7: ...of a read cycle when emerging from a deselected state ADV Input Synchronous Advance Input signal sampled on the rising edge of CLK active LOW When asserted it automatically increments the address in a...

Page 8: ...he following conditions are satisfied at clock rise 1 ADSP is asserted LOW and 2 CE1 CE2 CE3 2 are all asserted active The address presented to A is loaded into the address register and the address ad...

Page 9: ...ar Burst Address Table MODE GND First Address A1 A0 Second Address A1 A0 Third Address A1 A0 Fourth Address A1 A0 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10 ZZ Mode Electrical Characteristics Par...

Page 10: ...Burst Current X X X L H H H L X L H D WRITE Cycle Suspend Burst Current H X X L X H H L X L H D Partial Truth Table for Read Write 5 9 Function CY7C1360C GW BWE BWD BWC BWB BWA Read H H X X X X Read H...

Page 11: ...e TAP controller All inputs are captured on the rising edge of TCK All outputs are driven from the falling edge of TCK Test MODE SELECT TMS The TMS input is used to give commands to the TAP controller...

Page 12: ...rresponds to one of the bumps on the SRAM package The MSB of the register is connected to TDI and the LSB is connected to TDO Identification ID Register The ID register is loaded with a vendor specifi...

Page 13: ...Repeatable results may not be possible To guarantee that the boundary scan register will capture the correct value of a signal the SRAM signal must be stabilized long enough to meet the TAP controller...

Page 14: ...Valid 10 ns tTDOX TCK Clock LOW to TDO Invalid 0 ns Set up Times tTMSS TMS Set up to TCK Clock Rise 5 ns tTDIS TDI Set up to TCK Clock Rise 5 ns tCS Capture Set up to TCK Rise 5 ns Hold Times tTMSH TM...

Page 15: ...Description Conditions Min Max Unit Scan Register Sizes Register Name Bit Size x36 Bit Size x18 Instruction 3 3 Bypass 1 1 ID 32 32 Boundary Scan Order 119 ball BGA package 71 71 Boundary Scan Order...

Page 16: ...50 L1 DQB 15 D11 DQB 51 K1 DQD 15 D11 DQA 51 K1 DQB 16 E11 DQB 52 J1 DQD 16 E11 DQA 52 J1 DQB 17 F11 DQB 53 Internal Internal 17 F11 DQA 53 Internal Internal 18 G11 DQB 54 G2 DQC 18 G11 DQA 54 G2 DQB...

Page 17: ...0 M2 DQB 15 E7 DQB 51 L1 DQD 15 E7 DQA 51 L1 DQB 16 F6 DQB 52 K2 DQD 16 F6 DQA 52 K2 DQB 17 G7 DQB 53 Internal Internal 17 G7 DQA 53 Internal Internal 18 H6 DQB 54 H1 DQC 18 H6 DQA 54 H1 DQB 19 T7 ZZ...

Page 18: ...for 2 5V I O 1 7 VDD 0 3V V VIL Input LOW Voltage 14 for 3 3V I O 0 3 0 8 V for 2 5V I O 0 3 0 7 V IX Input Leakage Current except ZZ and MODE GND VI VDDQ 5 5 A Input Current of MODE Input VSS 30 A I...

Page 19: ...ion to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance per EIA JESD51 29 41 34 1 16 8 C W JC Thermal Resistance Junction to Case 6 13 14 0 3 C W AC...

Page 20: ...Hold Times tAH Address Hold after CLK Rise 0 4 0 5 0 5 ns tADH ADSP ADSC Hold after CLK Rise 0 4 0 5 0 5 ns tADVH ADV Hold after CLK Rise 0 4 0 5 0 5 ns tWEH GW BWE BWX Hold after CLK Rise 0 4 0 5 0 5...

Page 21: ...LOW or CE3 is HIGH tCYC t CL CLK ADSP t ADH t ADS ADDRESS t CH OE ADSC CE tAH tAS A1 tCEH tCES GW BWE BWx Data Out Q High Z tCLZ tDOH tCO ADV tOEHZ tCO Single READ BURST READ tOEV tOELZ tCHZ ADV suspe...

Page 22: ...ADH tADS ADDRESS tCH OE ADSC CE tAH tAS A1 tCEH tCES BWE BWX Data Out Q High Z ADV BURST READ BURST WRITE D A2 D A2 1 D A2 1 D A1 D A3 D A3 1 D A3 2 D A2 3 A2 A3 Data In D Extended BURST WRITE D A2 2...

Page 23: ...nitiated by ADSP or ADSC 26 GW is HIGH Switching Waveforms continued tCYC tCL CLK ADSP tADH tADS ADDRESS tCH OE ADSC CE tAH tAS A2 tCEH tCES BWE BWX Data Out Q High Z ADV Single WRITE D A3 A4 A5 A6 D...

Page 24: ...when entering ZZ mode See Cycle Descriptions table for all possible signal conditions to deselect the device 28 DQs are in High Z when exiting ZZ sleep mode Switching Waveforms continued t ZZ I SUPPLY...

Page 25: ...rid Array 14 x 22 x 2 4 mm Lead Free CY7C1362C 166BGXC CY7C1360C 166BZC 51 85180 165 ball Fine Pitch Ball Grid Array 13 x 15 x 1 4 mm CY7C1362C 166BZC CY7C1360C 166BZXC 51 85180 165 ball Fine Pitch Ba...

Page 26: ...Lead Free CY7C1362C 200BZXC CY7C1360C 200AXI 51 85050 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Lead Free 3 Chip Enable Industrial CY7C1362C 200AXI CY7C1360C 200AJXI 51 85050 100 pin Thin Quad Flat...

Page 27: ...Lead Free CY7C1362C 250BZXC CY7C1360C 250AXI 51 85050 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Lead Free 3 Chip Enable Industrial CY7C1362C 250AXI CY7C1360C 250AJXI 51 85050 100 pin Thin Quad Flat...

Page 28: ...N MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0 20 1 40 0 05 12 1 1 60 MAX 0 05 MIN 0 60 0 15 0 MIN 0 25 0 7 8X STAND OFF R 0 0...

Page 29: ...J U P N M T R 12 00 19 50 30 TYP 2 40 MAX A1 CORNER 0 70 REF U T R P N M L K J H G F E D C A B 2 1 4 3 6 5 7 1 00 3X REF 7 62 22 00 0 20 14 00 0 20 1 27 0 60 0 10 C 0 15 C B A 0 15 4X 0 05 M C 0 75 0...

Page 30: ...tion PowerPC is a trademark of IBM Corporation All product and company names mentioned in this document are the trademarks of their respective holders Package Diagrams continued A 1 PIN 1 CORNER 15 00...

Page 31: ...as per JEDEC Standard Removed comment of Lead free BG and BZ packages availability D 332879 See ECN PCI Unshaded 200 and 166 MHz speed bins in the AC DC Table and Selection Guide Added Address Expans...

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