CY7C1360C
CY7C1362C
Document #: 38-05540 Rev. *H
Page 19 of 31
Capacitance
[16]
Parameter
Description
Test Conditions
100 TQFP
Max.
119 BGA
Max.
165 FBGA
Max.
Unit
C
IN
Input
Capacitance
T
A
= 25°C, f = 1 MHz,
V
DD
= 3.3V
V
DDQ
= 2.5V
5
5
5
pF
C
CLK
Clock Input Capacitance
5
5
5
pF
C
I/O
Input/Output Capacitance
5
7
7
pF
Thermal Resistance
[16]
Parameter
Description
Test Conditions
100 TQFP
Package
119 BGA
Package
165 FBGA
Package
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard test
methods and procedures for
measuring thermal impedance, per
EIA/JESD51.
29.41
34.1
16.8
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
6.13
14.0
3
°C/W
AC Test Loads and Waveforms
OUTPUT
R = 317
Ω
R = 351
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
T
= 1.5V
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤
1 ns
≤
1 ns
(c)
OUTPUT
R = 1667
Ω
R =1538
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤
1 ns
≤
1 ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
Note:
16. Tested initially and after any design or process change that may affect these parameters.
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