Cypress Semiconductor CY7C1360C Specification Sheet Download Page 1

 

9-Mbit (256K x 36/512K x 18) Pipelined SRAM

CY7C1360C
CY7C1362C

Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document #: 38-05540 Rev. *H

 Revised September 14, 2006

Features

• Supports bus operation up to 250 MHz

• Available speed grades are 250, 200, and 166 MHz

• Registered inputs and outputs for pipelined operation

• 3.3V core power supply (V

DD

)

• 2.5V/3.3V I/O operation (V

DDQ

)

• Fast clock-to-output times 

— 2.8 ns (for 250-MHz device)

• Provide high-performance 3-1-1-1 access rate

User-selectable burst counter supporting Intel

®

 

Pentium

®

 interleaved or linear burst sequences

• Separate processor and controller address strobes

• Synchronous self-timed writes

• Asynchronous output enable

• Single Cycle Chip Deselect

• Available in lead-free 100-Pin TQFP package, lead-free 

and non lead-free 119-Ball BGA package and 165-Ball 
FBGA package

• TQFP Available with 3-Chip Enable and 2-Chip Enable

• IEEE 1149.1 JTAG-Compatible Boundary Scan

Functional Description

[1]

The CY7C1360C/CY7C1362C SRAM integrates 256K x 36
and 512K x 18 SRAM cells with advanced synchronous
peripheral circuitry and a two-bit counter for internal burst
operation. All synchronous inputs are gated by registers
controlled by a positive-edge-triggered Clock Input (CLK). The
synchronous inputs include all addresses, all data inputs,
address-pipelining Chip Enable (CE

1

), depth-expansion Chip

Enables (CE

2

 and

 

CE

3

[2]

), Burst Control inputs (ADSC, ADSP,

and ADV), Write Enables (BW

X

, and BWE), and Global Write

(GW). Asynchronous inputs include the Output Enable (OE)
and the ZZ pin.

Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).

Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle.This part supports Byte Write
operations (see Pin Descriptions and Truth Table for further
details). Write cycles can be one to two or four bytes wide as
controlled by the Byte Write control inputs. GW when active
LOW causes all bytes to be written. 

The CY7C1360C/CY7C1362C operates from a +3.3V core
power supply while all outputs may operate with either a +2.5
or +3.3V supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.

Notes: 

1. For best-practices recommendations, please refer to the Cypress application note 

System Design Guidelines 

on www.cypress.com.

2. CE

3

 is for A version of TQFP (3 Chip Enable option) and 165 FBGA package only. 119 BGA is offered only in 2 Chip Enable.

A0, A1, A

ADDRESS
REGISTER

ADV

CLK

BURST

COUNTER AND

LOGIC

CLR

Q1

Q0

ADSC

BW

B

BW

A

CE

1

DQ

B,

DQP

B

WRITE REGISTER

DQ

A,

DQP

A

WRITE REGISTER

ENABLE

REGISTER

OE

SENSE

AMPS

MEMORY

ARRAY

ADSP

2

MODE

CE2
CE3

GW

BWE

PIPELINED

ENABLE

DQs
DQP

A

DQP

B

OUTPUT

REGISTERS

INPUT

REGISTERS

E

DQ

A,

DQP

A

WRITE DRIVER

OUTPUT

BUFFERS

DQ

B,

DQP

B

WRITE DRIVER

A[1:0]

ZZ

SLEEP

CONTROL

Logic Block Diagram – CY7C1362C (512K x 18)

[+] Feedback 

Summary of Contents for CY7C1360C

Page 1: ...2 Burst Control inputs ADSC ADSP and ADV Write Enables BWX and BWE and Global Write GW Asynchronous inputs include the Output Enable OE and the ZZ pin Addresses and chip enables are registered at ris...

Page 2: ...DSC MODE BWE GW CE1 CE2 CE3 OE ENABLE REGISTER OUTPUT REGISTERS SENSE AMPS OUTPUT BUFFERS E PIPELINED ENABLE INPUT REGISTERS A0 A1 A BWB BWC BWD BWA MEMORY ARRAY DQs DQPA DQPB DQPC DQPD SLEEP CONTROL...

Page 3: ...2 61 60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 MODE CY7C1360C 256K X 36 NC A A A A A 1 A 0 NC 72M NC 36M V SS V DD NC 18M A A A A A A A A A NC NC VDDQ...

Page 4: ...63 62 61 60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 MODE CY7C1360C 256K X 36 NC A A A A A 1 A 0 NC 72M NC 36M V SS V DD A A A A A A A A NC NC VDDQ VSSQ...

Page 5: ...C NC CE1 OE ADV GW VSS VSS VSS VSS VSS VSS VSS VSS DQPA MODE DQPD DQPB BWB BWC NC VDD NC BWA NC BWE BWD ZZ 2 3 4 5 6 7 1 A B C D E F G H J K L M N P R T U VDDQ NC 288M NC 144M NC DQB DQB DQB DQB A A A...

Page 6: ...DQB NC DQB NC DQA DQA VDD VDDQ VDD VDDQ DQB VDD NC VDD DQA VDD VDDQ DQA VDDQ VDD VDD VDDQ VDD VDDQ DQA VDDQ A A VSS A A A DQB DQB DQB ZZ DQA DQA DQPA DQA A VDDQ A CY7C1362C 512K x 18 A0 A VSS 2 3 4 5...

Page 7: ...of a read cycle when emerging from a deselected state ADV Input Synchronous Advance Input signal sampled on the rising edge of CLK active LOW When asserted it automatically increments the address in a...

Page 8: ...he following conditions are satisfied at clock rise 1 ADSP is asserted LOW and 2 CE1 CE2 CE3 2 are all asserted active The address presented to A is loaded into the address register and the address ad...

Page 9: ...ar Burst Address Table MODE GND First Address A1 A0 Second Address A1 A0 Third Address A1 A0 Fourth Address A1 A0 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10 ZZ Mode Electrical Characteristics Par...

Page 10: ...Burst Current X X X L H H H L X L H D WRITE Cycle Suspend Burst Current H X X L X H H L X L H D Partial Truth Table for Read Write 5 9 Function CY7C1360C GW BWE BWD BWC BWB BWA Read H H X X X X Read H...

Page 11: ...e TAP controller All inputs are captured on the rising edge of TCK All outputs are driven from the falling edge of TCK Test MODE SELECT TMS The TMS input is used to give commands to the TAP controller...

Page 12: ...rresponds to one of the bumps on the SRAM package The MSB of the register is connected to TDI and the LSB is connected to TDO Identification ID Register The ID register is loaded with a vendor specifi...

Page 13: ...Repeatable results may not be possible To guarantee that the boundary scan register will capture the correct value of a signal the SRAM signal must be stabilized long enough to meet the TAP controller...

Page 14: ...Valid 10 ns tTDOX TCK Clock LOW to TDO Invalid 0 ns Set up Times tTMSS TMS Set up to TCK Clock Rise 5 ns tTDIS TDI Set up to TCK Clock Rise 5 ns tCS Capture Set up to TCK Rise 5 ns Hold Times tTMSH TM...

Page 15: ...Description Conditions Min Max Unit Scan Register Sizes Register Name Bit Size x36 Bit Size x18 Instruction 3 3 Bypass 1 1 ID 32 32 Boundary Scan Order 119 ball BGA package 71 71 Boundary Scan Order...

Page 16: ...50 L1 DQB 15 D11 DQB 51 K1 DQD 15 D11 DQA 51 K1 DQB 16 E11 DQB 52 J1 DQD 16 E11 DQA 52 J1 DQB 17 F11 DQB 53 Internal Internal 17 F11 DQA 53 Internal Internal 18 G11 DQB 54 G2 DQC 18 G11 DQA 54 G2 DQB...

Page 17: ...0 M2 DQB 15 E7 DQB 51 L1 DQD 15 E7 DQA 51 L1 DQB 16 F6 DQB 52 K2 DQD 16 F6 DQA 52 K2 DQB 17 G7 DQB 53 Internal Internal 17 G7 DQA 53 Internal Internal 18 H6 DQB 54 H1 DQC 18 H6 DQA 54 H1 DQB 19 T7 ZZ...

Page 18: ...for 2 5V I O 1 7 VDD 0 3V V VIL Input LOW Voltage 14 for 3 3V I O 0 3 0 8 V for 2 5V I O 0 3 0 7 V IX Input Leakage Current except ZZ and MODE GND VI VDDQ 5 5 A Input Current of MODE Input VSS 30 A I...

Page 19: ...ion to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance per EIA JESD51 29 41 34 1 16 8 C W JC Thermal Resistance Junction to Case 6 13 14 0 3 C W AC...

Page 20: ...Hold Times tAH Address Hold after CLK Rise 0 4 0 5 0 5 ns tADH ADSP ADSC Hold after CLK Rise 0 4 0 5 0 5 ns tADVH ADV Hold after CLK Rise 0 4 0 5 0 5 ns tWEH GW BWE BWX Hold after CLK Rise 0 4 0 5 0 5...

Page 21: ...LOW or CE3 is HIGH tCYC t CL CLK ADSP t ADH t ADS ADDRESS t CH OE ADSC CE tAH tAS A1 tCEH tCES GW BWE BWx Data Out Q High Z tCLZ tDOH tCO ADV tOEHZ tCO Single READ BURST READ tOEV tOELZ tCHZ ADV suspe...

Page 22: ...ADH tADS ADDRESS tCH OE ADSC CE tAH tAS A1 tCEH tCES BWE BWX Data Out Q High Z ADV BURST READ BURST WRITE D A2 D A2 1 D A2 1 D A1 D A3 D A3 1 D A3 2 D A2 3 A2 A3 Data In D Extended BURST WRITE D A2 2...

Page 23: ...nitiated by ADSP or ADSC 26 GW is HIGH Switching Waveforms continued tCYC tCL CLK ADSP tADH tADS ADDRESS tCH OE ADSC CE tAH tAS A2 tCEH tCES BWE BWX Data Out Q High Z ADV Single WRITE D A3 A4 A5 A6 D...

Page 24: ...when entering ZZ mode See Cycle Descriptions table for all possible signal conditions to deselect the device 28 DQs are in High Z when exiting ZZ sleep mode Switching Waveforms continued t ZZ I SUPPLY...

Page 25: ...rid Array 14 x 22 x 2 4 mm Lead Free CY7C1362C 166BGXC CY7C1360C 166BZC 51 85180 165 ball Fine Pitch Ball Grid Array 13 x 15 x 1 4 mm CY7C1362C 166BZC CY7C1360C 166BZXC 51 85180 165 ball Fine Pitch Ba...

Page 26: ...Lead Free CY7C1362C 200BZXC CY7C1360C 200AXI 51 85050 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Lead Free 3 Chip Enable Industrial CY7C1362C 200AXI CY7C1360C 200AJXI 51 85050 100 pin Thin Quad Flat...

Page 27: ...Lead Free CY7C1362C 250BZXC CY7C1360C 250AXI 51 85050 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Lead Free 3 Chip Enable Industrial CY7C1362C 250AXI CY7C1360C 250AJXI 51 85050 100 pin Thin Quad Flat...

Page 28: ...N MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0 20 1 40 0 05 12 1 1 60 MAX 0 05 MIN 0 60 0 15 0 MIN 0 25 0 7 8X STAND OFF R 0 0...

Page 29: ...J U P N M T R 12 00 19 50 30 TYP 2 40 MAX A1 CORNER 0 70 REF U T R P N M L K J H G F E D C A B 2 1 4 3 6 5 7 1 00 3X REF 7 62 22 00 0 20 14 00 0 20 1 27 0 60 0 10 C 0 15 C B A 0 15 4X 0 05 M C 0 75 0...

Page 30: ...tion PowerPC is a trademark of IBM Corporation All product and company names mentioned in this document are the trademarks of their respective holders Package Diagrams continued A 1 PIN 1 CORNER 15 00...

Page 31: ...as per JEDEC Standard Removed comment of Lead free BG and BZ packages availability D 332879 See ECN PCI Unshaded 200 and 166 MHz speed bins in the AC DC Table and Selection Guide Added Address Expans...

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