CY7C1218H
Document #: 38-05667 Rev. *B
Page 3 of 16
Pin Definitions
Name
I/O
Description
A
0
, A
1
, A
Input-
Synchronous
Address Inputs used to select one of the 32K address locations
. Sampled at the rising edge
of the CLK if ADSP or ADSC is active LOW, and CE
1
, CE
2
, and CE
3
are sampled active. A
1
, A
0
feed the 2-bit counter.
BW
A
,
BW
B
BW
C
,
BW
D
Input-
Synchronous
Byte Write Select Inputs, active LOW
. Qualified with BWE to conduct Byte Writes to the SRAM.
Sampled on the rising edge of CLK.
GW
Input-
Synchronous
Global Write Enable Input, active LOW
. When asserted LOW on the rising edge of CLK, a global
Write is conducted (ALL bytes are written, regardless of the values on BW
[A:D]
and BWE).
BWE
Input-
Synchronous
Byte Write Enable Input, active LOW
. Sampled on the rising edge of CLK. This signal must be
asserted LOW to conduct a Byte Write.
CLK
Input-
Clock
Clock Input
. Used to capture all synchronous inputs to the device. Also used to increment the burst
counter when ADV is asserted LOW, during a burst operation.
CE
1
Input-
Synchronous
Chip Enable 1 Input, active LOW
. Sampled on the rising edge of CLK. Used in conjunction with
CE
2
and CE
3
to select/deselect the device. ADSP is ignored if CE
1
is HIGH. CE
1
is sampled only
when a new external address is loaded.
CE
2
Input-
Synchronous
Chip Enable 2 Input, active HIGH
. Sampled on the rising edge of CLK. Used in conjunction with
CE
1
and CE
3
to select/deselect the device. CE
2
is sampled only when a new external address is
loaded.
CE
3
Input-
Synchronous
Chip Enable 3 Input, active LOW
. Sampled on the rising edge of CLK. Used in conjunction with
CE
1
and
CE
2
to select/deselect the device. Not connected for BGA. Where referenced, CE
3
is
assumed active throughout this document for BGA. CE
3
is sampled only when a new external
address is loaded.
OE
Input-
Asynchronous
Output Enable, asynchronous input, active LOW
. Controls the direction of the I/O pins. When
LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as
input data pins. OE is masked during the first clock of a Read cycle when emerging from a
deselected state.
ADV
Input-
Synchronous
Advance Input signal, sampled on the rising edge of CLK
,
active LOW
. When asserted, it
automatically increments the address in a burst cycle.
ADSP
Input-
Synchronous
Address Strobe from Processor, sampled on the rising edge of CLK, active LOW
. When
asserted LOW, A is captured in the address registers. A
1
, A
0
are also loaded into the burst counter.
When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is ignored when CE
1
is deasserted HIGH.
ADSC
Input-
Synchronous
Address Strobe from Controller, sampled on the rising edge of CLK, active LOW
. When
asserted LOW, A is captured in the address registers. A
1
, A
0
are also loaded into the burst counter.
When ADSP and ADSC are both asserted, only ADSP is recognized.
ZZ
Input-
Asynchronous
ZZ “Sleep” Input, active HIGH
. This input, when High places the device in a non-time-critical
“sleep” condition with data integrity preserved. For normal operation, this pin has to be LOW or left
floating. ZZ pin has an internal pull-down.
DQ
A,
DQ
B
DQ
C,
DQ
D
DQP
A,
DQP
B
I/O-
Synchronous
Bidirectional Data I/O lines
. As inputs, they feed into an on-chip data register that is triggered by
the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified
by “A” during the previous clock rise of the Read cycle. The direction of the pins is controlled by
OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQs and DQP
[A:D]
are
placed in a tri-state condition.
V
DD
Power Supply
Power supply inputs to the core of the device
.
V
SS
Ground
Ground for the core of the device
.
V
DDQ
I/O Power
Supply
Power supply for the I/O circuitry
.
V
SSQ
I/O Ground
Ground for the I/O circuitry
.
MODE
Input-
Static
Selects Burst Order
. When tied to GND selects linear burst sequence. When tied to V
DD
or left
floating selects interleaved burst sequence. This is a strap pin and should remain static during
device operation. Mode Pin has an internal pull-up.
NC
No Connects
. Not internally connected to the die. 2M, 4M, 9M,18M, 72M, 144M, 288M, 576M and
1G are address expansion pins and are not internally connected to the die.
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