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Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document Number: 001-08353 Rev. *C

 Revised November 6, 2008

CY7C1024DV33

3-Mbit (128K X 24) Static RAM

Features

High speed

t

AA

 = 10 ns

Low active power

I

CC

 = 175 mA at 10 ns

Low CMOS standby power

I

SB2

 = 25 mA 

Operating voltages of 3.3 ± 0.3V

2.0V data retention 

Automatic power down when deselected

TTL compatible inputs and outputs

Easy memory expansion with CE

1

, CE

2

, and CE

3

 features

Available in Pb-free standard 119-ball PBGA

Functional Description

The CY7C1024DV33 is a high performance CMOS static RAM
organized as 128K words by 24 bits. This device has an
automatic power down feature that significantly reduces power
consumption when deselected. 

To write to the device, enable the chip (CE

1

 LOW, CE

2

 HIGH,

and CE

3

 LOW), while forcing the Write Enable (WE) input LOW. 

To read from the device, enable the chip by taking CE

1

 LOW, CE

2

HIGH, and CE

3

 LOW while forcing the Output Enable (OE) LOW

and the Write Enable (WE) HIGH. See the 

Truth Table

 on page

7 for a complete description of Read and Write modes.

The 24 I/O pins (I/O

to I/O

23

) are placed in a high impedance

state when the device is deselected (CE

1

 HIGH, CE

2

 LOW, or

CE

3

 HIGH) or when the output enable (OE) is HIGH during a

write operation. (CE

1

 LOW, CE

2

 HIGH, CE

3

 LOW, and WE

LOW).

 

Logic Block Diagram

COLUMN

DECODER

RO

W DECODER

SE

N

S

E AM

P

S

INPUT BUFFER

128K x 24

ARRAY

I/O

– I/O

23

OE

CE

1

, CE

2

, CE

3

WE

CONTROL LOGIC

A

(9:0)

A

(16:10)

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Summary of Contents for CY7C1024DV33

Page 1: ...ice has an automatic power down feature that significantly reduces power consumption when deselected To write to the device enable the chip CE1 LOW CE2 HIGH and CE3 LOW while forcing the Write Enable...

Page 2: ...2 NC CE3 NC I O0 D I O13 VDD VSS VSS VSS VDD I O1 E I O14 VSS VDD VSS VDD VSS I O2 F I O15 VDD VSS VSS VSS VDD I O3 G I O16 VSS VDD VSS VDD VSS I O4 H I O17 VDD VSS VSS VSS VDD I O5 J NC VSS VDD VSS V...

Page 3: ...eakage Current GND VOUT VCC output disabled 1 1 A ICC VCC Operating Supply Current VCC Max f fMAX 1 tRC IOUT 0 mA CMOS levels 175 mA ISB1 Automatic CE Power Down Current TTL Inputs Max VCC CE VIH VIN...

Page 4: ...nsists of all components of the test environment Rise Time 1V ns Including jig and scope Notes 4 Valid SRAM operation does not occur until the power supplies have reached the minimum operating VDD 3 0...

Page 5: ...12 Operation Recovery Time tRC ns Data Retention Waveform AC Switching Characteristics continued Over the Operating Range 5 Parameter Description 10 Unit Min Max 3 0V 3 0V tCDR VDR 2V DATA RETENTION...

Page 6: ...DATA VALID tRC tACE tDOE tLZOE tLZCE tPU HIGH IMPEDANCE tHZOE tHZCE tPD HIGH ICC ISB IMPEDANCE OE CE ADDRESS DATA OUT VCC SUPPLY CURRENT tWC DATA VALID tAW tSA tPWE tHA tHD tSD tSCE tSCE CE WE DATA I...

Page 7: ...andby ISB X X H X X High Z Power Down Standby ISB L H L L H Full Data Out Read Active ICC L H L X L Full Data In Write Active ICC L H L H H High Z Selected Outputs Disabled Active ICC Switching Wavefo...

Page 8: ...g Information Speed ns Ordering Code Package Name Package Type Operating Range 10 CY7C1024DV33 10BGXI 51 85115 119 Ball Plastic Ball Grid Array 14 x 22 x 2 4 mm Pb Free Industrial Package Diagram Figu...

Page 9: ...to the materials described herein Cypress does not assume any liability arising out of the application or use of any product or circuit described herein Cypress does not authorize its products for us...

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