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4-Mb (256K x 16) Static RAM

CY62147DV18

MoBL2™

Cypress Semiconductor Corporation

     

     

3901 North First Street

     

     

San Jose

CA  95134

     

     

408-943-2600

 

Document #: 38-05343 Rev. *B

 Revised February 26, 2004

Features

• Very high speed: 55 ns and 70 ns
• Wide voltage range: 1.65V – 2.25V
• Pin-compatible with CY62147CV18
• Ultra-low active power

—  Typical active current: 1 mA @ f = 1 MHz
—  Typical active current: 6 mA @ f = f

max

 

• Ultra low standby power
• Easy memory expansion with CE, and OE features
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Packages offered 48-ball BGA

Functional Description

[1]

The CY62147DV18 is a high-performance CMOS static RAM 

organized as 256K words by 16 bits. This device features ad-

vanced circuit design to provide ultra-low active current. This 

is ideal for providing More Battery Life™ (MoBL™) in portable 

applications such as cellular telephones. The device also has 

an automatic power-down feature that significantly reduces 

power consumption. The device can also be put into standby 

mode reducing power consumption by more than 99% when 

deselected (CE HIGH or both BLE and BHE are HIGH). The 

input/output pins (I/O

0

 through I/O

15

) are placed in a high-im-

pedance state when: deselected (CE HIGH), outputs are dis-

abled (OE HIGH), both Byte High Enable and Byte Low Enable 

are disabled (BHE, BLE HIGH), or during a write operation (CE

LOW and WE LOW).
Writing to the device is accomplished by asserting Chip En-

able (CE) and Write Enable (WE) inputs LOW. If Byte Low 

Enable (BLE) is LOW, then data from I/O pins (I/O

0

 through 

I/O

7

), is written into the location specified on the address pins 

(A

0

 through A

17

). If Byte High Enable (BHE) is LOW, then data 

from I/O pins (I/O

8

 through I/O

15

) is written into the location 

specified on the address pins (A

0

 through A

17

).

Reading from the device is accomplished by asserting Chip 

Enable (CE) and Output Enable (OE) LOW while forcing the 

Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, 

then data from the memory location specified by the address 

pins will appear on I/O

0

 to I/O

7

. If Byte High Enable (BHE) is 

LOW, then data from memory will appear on I/O

8

 to I/O

15

. See 

the truth table for a complete description of read and write 

modes.
The CY62147DV18 is available in a 48-ball FBGA package. 

Note:

1.

For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.

Logic Block Diagram

256K x 16

RAM Array

I/O

0

 – I/O

7

ROW

 DEC

O

DE

A

8

A

7

A

6

A

5

A

2

COLUMN DECODER

A

11

A

12

A

13

A

14

A

15

SE

NS

E A

M

PS

DATA IN DRIVERS

OE

A

4

A

3

I/O

8

 – I/O

15

CE

WE

BLE

BHE

A

16

A

0

A

1

A

17

A

9

Power

-

Down

Circuit

A

10

[+] Feedback 

Summary of Contents for CY62147DV18

Page 1: ...ted CE HIGH outputs are dis abled OE HIGH both Byte High Enable and Byte Low Enable are disabled BHE BLE HIGH or during a write operation CE LOW and WE LOW Writing to the device is accomplished by asserting Chip En able CE and Write Enable WE inputs LOW If Byte Low Enable BLE is LOW then data from I O pins I O0 through I O7 is written into the location specified on the address pins A0 through A17 ...

Page 2: ...ng or tied to Vss to ensure proper application 4 Pins H1 G2 and H6 in the BGA package are address expansion pins for 8 Mb 16 Mb and 32 Mb respectively WE A11 A10 A6 A0 A3 CE I O10 I O8 I O9 A4 A5 I O11 I O13 I O12 I O14 I O15 VSS A9 A8 OE Vss A7 I O0 BHE NC A17 A2 A1 BLE VCC I O2 I O1 I O3 I O4 I O5 I O6 I O7 A15 A14 A13 A12 NC NC NC 3 2 6 5 4 1 D E B A C F G H A16 DNU Vcc Feedback ...

Page 3: ...10 12 CY62147DV18L 1 65 1 8 2 25 70 1 0 2 0 6 15 0 5 18 CY62147DV18LL 10 12 Electrical Characteristics Over the Operating Range Parameter Description Test Conditions CY62147DV18 55 CY62147DV18 70 Unit Min Typ 7 Max Min Typ 7 Max VOH Output HIGH Voltage IOH 0 1 mA VCC 1 65V 1 4 1 4 V VOL Output LOW Voltage IOL 0 1 mA VCC 1 65V 0 2 0 2 V VIH Input HIGH Voltage VCC 1 65V to 2 25V 1 4 VCC 0 2V 1 4 VCC...

Page 4: ... 4 5 inch four layer printed circuit board 75 C W ΘJC Thermal Resistance Junction to Case 8 10 C W AC Test Loads and Waveforms Parameters 1 80V Unit R1 13500 Ω R2 10800 Ω RTH 6000 Ω VTH 0 80 V Data Retention Characteristics Over the Operating Range Parameter Description Conditions Min Typ 7 Max Unit VDR VCC for Data Retention 1 0 V ICCDR Data Retention Current VCC 1 0V CE VCC 0 2V VIN VCC 0 2V or ...

Page 5: ...ns tHD Data Hold from Write End 0 0 ns tHZWE WE LOW to High Z 11 12 20 25 ns tLZWE WE HIGH to Low Z 11 10 10 ns Notes 9 BHE BLE is the AND of both BHE and BLE Chip can be deselected by either disabling the chip enable signal or by disabling both BHE and BLE 10 Test conditions for all parameters other than three state parameters assume signal transition time of 1V ns or less timing reference levels...

Page 6: ...s valid prior to or coincident with CE and BHE BLE transition LOW ADDRESS DATA OUT PREVIOUS DATA VALID DATA VALID tRC tAA tOHA Read Cycle 1 Address Transition Controlled 14 15 Read Cycle No 2 OE Controlled 15 16 50 50 DATA VALID tRC tACE tLZBE tLZCE tPU DATA OUT HIGH IMPEDANCE IMPEDANCE ICC ISB tHZOE tHZCE tPD OE CE HIGH VCC SUPPLY CURRENT tHZBE BHE BLE tLZOE ADDRESS tDBE tDOE Feedback ...

Page 7: ...9 During this period the I Os are in output state and input signals should not be applied Switching Waveforms continued tHD tSD tPWE tSA tHA tAW tWC DATA I O ADDRESS CE WE OE tHZOE DATAIN NOTE Write Cycle No 1 WE Controlled 13 17 18 19 BHE BLE tBW tSCE tHD tSD tPWE tHA tAW tSCE tWC tHZOE DATAIN CE ADDRESS WE DATA I O OE NOTE 19 Write Cycle No 2 CE Controlled BHE BLE tBW 13 17 18 tSA Feedback ...

Page 8: ...DATAIN tHD tSD tLZWE tPWE tSA tHA tAW tSCE tWC tHZWE CE ADDRESS WE DATAI O NOTE 19 Write Cycle No 3 WE Controlled OE LOW tBW BHE BLE 18 DATA I O ADDRESS tHD tSD tSA tHA tAW tWC CE WE DATAIN Write Cycle No 4 BHE BLE Controlled OE LOW 18 NOTE 19 tBW BHE BLE tSCE tPWE tHZWE tLZWE Feedback ...

Page 9: ...t Disabled Active ICC L L X L L Data In I OO I O15 Write Active ICC L L X H L Data In I OO I O7 I O8 I O15 in High Z Write Lower byte only Active ICC L L X L H Data In I O8 I O15 I O0 I O7 in High Z Write Higher byte only Active ICC Ordering Information Speed ns Ordering Code Package Name Package Type Operating Range 55 CY62147DV18L 55BVI BV48A 48 ball Fine Pitch BGA 6 mm 8mm 1 mm Industrial CY621...

Page 10: ... use as critical components in life support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user The inclusion of Cypress Semiconductor products in life support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges MoBL is a registered trademark an...

Page 11: ...pec from 2 20V to 2 25V Modified VIH spec on footnote 6 from VCC MAX 0 5V to VCC MAX 0 75V Changed ICC TYP values from 8 mA to 6 mA Changed ICC MAX values at Vcc max 1 95V from 15 mA to 12 mA L bin and 10 mA to 8mA LL bin Changed ICC MAX values at Vcc max 2 25V from 18 mA to 15 mA L bin and 12mA to 10 mA LL bin With modified Vcc MAX spec changed ISB1 and ISB2 MAX values from 15 uA to 18 uA L bin a...

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