CY62146EV30 MoBL
®
Document #: 38-05567 Rev. *C
Page 3 of 12
Maximum Ratings
Exceeding the maximum ratings may impair the useful life of
the device. These user guidelines are not tested.
Storage Temperature ................................ –65°C to + 150°C
Ambient Temperature with
Power Applied ........................................... –55°C to + 125°C
Supply Voltage to Ground
Potential .............................–0.3V to + 3.9V (V
CCmax
+ 0.3V)
DC Voltage Applied to Outputs
in High-Z State
[5, 6]
................–0.3V to 3.9V (V
CCmax
+ 0.3V)
DC Input Voltage
[5, 6]
........... –0.3V to 3.9V (V
CC max
+ 0.3V)
Output Current into Outputs (LOW) ............................ 20 mA
Static Discharge Voltage ......................................... >2001V
(per MIL-STD-883, Method 3015)
Latch-up Current ..................................................... >200 mA
Operating Range
Device
Range
Ambient
Temperature
V
CC
[7]
CY62146EV30
Industrial –40°C to +85°C 2.2V to 3.6V
Electrical Characteristics
(Over the Operating Range)
Parameter
Description
Test Conditions
45 ns
Unit
Min
Typ
[2]
Max
V
OH
Output HIGH Voltage
I
OH
= –0.1 mA
2.0
V
I
OH
= –1.0 mA, V
CC
> 2.70V
2.4
V
V
OL
Output LOW Voltage
I
OL
= 0.1 mA
0.4
V
I
OL
= 2.1 mA, V
CC
> 2.70V
0.4
V
V
IH
Input HIGH Voltage
V
CC
= 2.2V to 2.7V
1.8
V
CC
+ 0.3
V
V
CC
= 2.7V to 3.6V
2.2
V
CC
+ 0.3
V
V
IL
Input LOW Voltage
V
CC
= 2.2V to 2.7V
–0.3
0.6
V
V
CC
= 2.7V to 3.6V
–0.3
0.8
V
I
IX
Input Leakage Current
GND < V
I
< V
CC
–1
+1
µ
A
I
OZ
Output Leakage Current
GND < V
O
< V
CC
, Output Disabled
–1
+1
µ
A
I
CC
V
CC
Operating Supply Current f = f
max
= 1/t
RC
V
CC
= V
CC(max),
I
OUT
= 0 mA
CMOS levels
15
20
mA
f = 1 MHz
2
2.5
I
SB1
Automatic CE Power down
Current — CMOS Inputs
CE > V
CC
−
0.2V,
V
IN
> V
CC
–0.2V or V
IN
< 0.2V
f = f
max
(Address and Data Only),
f = 0 (OE, BHE, BLE and WE), V
CC
= 3.60V
1
7
µ
A
I
SB2
[8]
Automatic CE Power down
Current — CMOS Inputs
CE > V
CC
– 0.2V,
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V,
f = 0, V
CC
= 3.60V
1
7
µ
A
Notes:
5. V
IL(min)
= –2.0V for pulse durations less than 20 ns.
6. V
IH(max)
= V
CC
+ 0.75V for pulse durations less than 20 ns.
7. Full device AC operation assumes a minimum of 100
µ
s ramp time from 0 to V
cc
(min) and 200
µ
s wait time after V
cc
stabilization.
8. Only chip enable (CE) and byte enables (BHE and BLE) need to be tied to CMOS levels to meet the I
SB2
/ I
CCDR
spec. Other inputs can be left floating.