MityDSP-L138 Carrier Board Design Guide
March 5, 2014
Page 15 of 17
Document Revision: 1.7
– MityDSP-L138 Revision 4A
Critical Link reserves the right to make corrections, modifications, enhancements, and other changes to this document at any time and without notice.
4.3
Mounting Methods
The modules feature an additional optional mechanical attachment method. A hard mechanical attachment by
board-to-board standoffs and screw hardware may be used to mount the module. The corners of the free-
floating edge of the SOMs feature mounting holes that are compatible with 4-40 size mounting hardware. The
mechanical drawing in Figure 1 below illustrates the mechanical requirements of this optional attachment
method. Another option to secure the module is with the use of a screw, spacer and a self-clinching nut (PEM)
that is inserted into the carrier board mounting holes, please contact Critical Link for details about utilizing this
option.
Drawing is not to scale.
Socket Connector
MityDSP-L138, MitySOM-1808, MitySOM-1810, MityDSP-6748 Module
Carrier Board
Standoff
&
Hardware
Module Center-Line
3.3mm
2.8mm
3.0mm
Figure 3: Standoff based Hold Down Concept Drawing
4.4
Shock & Vibration
For customers who are interested in using MityDSP modules in rugged environments, the optional mechanical
attachment methods discussed in section 4.3 above enable MityDSP modules to tolerate much greater
mechanical shock and vibration forces than without any additional mounting support.
4.5
Thermal Management
The MityDSP-L138 family of SOMs have no specific requirements regarding thermal management. The modules
can be operated without heat sinks or air flow, and inside tight enclosures. However, if a module is intended to
be used in hot industrial environments, it is advisable to do plenty of testing in the enclosure and environment
that the module will be used in. In these cases, it may be necessary to either add thermal management to the
enclosure, or lower the operating temperature specification of the end product.
