Cee® Apogee™ 300 Bake Plate Manual
Page
20
of
23
4.8. Oven vs. Bake Plate Examples
The chart below presents process examples for a commonly used resins. These figures should
not be use as a rigid guideline, since the best method with a particular baking application can only
be achieved through experimentation.
▪
APPLICATION:
Positive Photo Resist
▪
OVEN BAKE
▪
90°C
– 30 minutes, Polyimide beta (partial imidization)
▪
135°C
– 30 minutes, Polyimide alpha (solvent removal)
▪
HOTPLATE BAKE
▪
115°C
– 30 secs w/Hard Contact bake, Polyimide beta (partial imidization)
▪
150°C
– 15 secs w/Proximity bake, 150°C – 90 secs w/Hard Contact bake, Polyimide
alpha (solvent removal)
4.9. Reflow Soldering
Bake plate processing heats the substrate and
the solder without applying heat directly to the
devices on the board. Using a combination of
proximity and hard-contact bakes, the bake
profile can be adjusted to suit any process.
