Copyright
©
2017
congatec
AG
IA50m10
19/59
4
Cooling Solution
The conga-IA5 SBC offers Ultra Low Power boards with high computing performance and outstanding graphics. Due to its low power
consumption, the SBC generates less heat and therefore requires less active cooling, allowing the use of quieter, lower profile coolers that are
better suited to small form factor systems.
Nonetheless, all electronics contain semiconductor devices which have operating temperature ranges that should be adhered to. This means
that for reliable operation, the thermal design of the conga-IA5 must be carefully considered. For this reason, it is imperative to provide
sufficient air flow to each of the components, to ensure the specified operating temperature of the conga-IA5 is maintained.
congatec AG offers the following cooling options for the conga-IA5:
• A congatec passive cooling solution for lidless die Celeron
®
and Pentium
®
(PN: 052830) or lidded die Atom™ (PN: 052831) variants in
combination with the conga-IA5 retention frame (PN: 052254). This cooling solution complies with the Thin Mini-ITX height specification
and features a Hi-Flow 225UT pressure sensitive, phase change thermal interface. Refer to section 4.2 “CSP Dimensions” for the dimensions
of the congatec heatspreaders.
• The use of a custom cooling solution in combination with the conga-IA5 retention frame.
Note
When a passive cooling is used, the end user must ensure that adequate air flow is maintained.
Passive Cooling Solution
Retention Frame
