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©
2017
congatec
AG
TSKLm16
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Signal
Pin #
Description
I/O
PU/PD Comment
AC/HDA_SDIN[1:0] B29-B30 Intel
®
High Definition Audio Serial Data In [0]: These signals are serial TDM
data inputs from the three codecs. The serial input is single-pumped for a bit
rate of 24 Mb/s for Intel
®
High Definition Audio.
I 3.3VSB
Pin B28 (HDA_SDIN2) is not connected.
Note
Some signals have special functionality during the reset process. They may bootstrap some basic important functions of the module. For more
information refer to section 9.2 “Boot Strap Signals”.
Table 26 ExpressCard Support Pins Signal Descriptions
Signal
Pin # Description
I/O
PU/PD
Comment
EXCD0_CPPE#
EXCD1_CPPE#
A49
B48
ExpressCard capable card request.
I 3.3V
PU 10k 3.3VSB
EXCD0_PERST#
EXCD1_PERST#
A48
B47
ExpressCard Reset
O 3.3V
PU 10k 3.3V
Table 27 LPC Signal Descriptions
Signal
Pin # Description
I/O
PU/PD
Comment
LPC_AD[0:3]
B4-B7
LPC multiplexed address, command and data bus
I/O 3.3V
LPC_FRAME#
B3
LPC frame indicates the start of an LPC cycle
O 3.3V
LPC_DRQ[0:1]#
B8-B9
LPC serial DMA request
I 3.3V
PU 10k 3.3V
LPC_SERIRQ
A50
LPC serial interrupt
I/O OD 3.3V PU 10k 3.3V
LPC_CLK
B10
LPC clock output - 24 MHz nominal
O 3.3V
Table 28 SPI BIOS Flash Interface Signal Descriptions
Signal
Pin # Description
I/O
PU/PD
Comment
SPI_CS#
B97
Chip select for Carrier Board SPI BIOS Flash.
O 3.3VSB
Carrier shall pull to SPI_POWER when
external SPI is provided but not used.
SPI_MISO
A92
Data in to module from carrier board SPI BIOS flash.
I 3.3VSB
SPI_MOSI
A95
Data out from module to carrier board SPI BIOS flash.
O 3.3VSB
SPI_CLK
A94
Clock from module to carrier board SPI BIOS flash.
O 3.3VSB
