Cinterion EGS3, Hardware Interface Description

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EGS3 Hardware Interface Description
Tables
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EGS3_HD_v01.000a Page 6 of 117 2009-08-12
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Tables
Table 1: Directives ....................................................................................................... 14
Table 2: Standards of North American type approval .................................................. 14
Table 3: Standards of European type approval............................................................ 14
Table 4: Requirements of quality ................................................................................. 15
Table 5: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 15
Table 6: Toxic or hazardous substances or elements with defined concentration limits 16
Table 7: Overview of operating modes ........................................................................ 24
Table 8: Signal states................................................................................................... 32
Table 9: Temperature dependent behavior.................................................................. 37
Table 10: Specifications of battery packs suited for use with EGS3 .............................. 43
Table 11: AT commands available in Charge-only mode .............................................. 45
Table 12: Comparison Charge-only and Charge mode ................................................. 46
Table 13: State transitions of EGS3 (except SLEEP mode) .......................................... 49
Table 14: Signals of the SIM interface (SMT application interface) ............................... 50
Table 15: DCE-DTE wiring of ASC0 .............................................................................. 52
Table 16: DCE-DTE wiring of ASC1 .............................................................................. 53
Table 17: Configuration combinations for the PCM interface......................................... 64
Table 18: Overview of DAI signal functions ................................................................... 64
Table 19: Return loss in the active band........................................................................ 71
Table 20: Absolute maximum ratings............................................................................. 75
Table 21: Board / battery temperature ........................................................................... 76
Table 22: Ambient temperature according to IEC 60068-2 (without forced air circulation) . 76
Table 23: Charging temperature .................................................................................... 76
Table 24: Storage conditions ......................................................................................... 77
Table 25: Summary of reliability test conditions............................................................. 78
Table 26: Pad assignments............................................................................................ 80
Table 27: Signal description........................................................................................... 81
Table 28: Power supply ratings...................................................................................... 88
Table 29: Current consumption during Tx burst for GSM 850MHz and GSM 900MHz . 89
Table 30: Current consumption during Tx burst for GSM 1800MHz and GSM 1900MHz 90
Table 31: Audio parameters adjustable by AT commands ............................................ 91
Table 32: Voiceband characteristics (typical)................................................................. 93
Table 33: Voiceband receive path.................................................................................. 94
Table 34: Voiceband transmit path ................................................................................ 96
Table 35: Air interface.................................................................................................... 97
Table 36: Measured electrostatic values........................................................................ 98
Table 37: Reflow temperature ratings .......................................................................... 104
Table 38: List of parts and accessories........................................................................ 116
Table 39: Molex sales contacts (subject to change) .................................................... 117
Table 40: Hirose sales contacts (subject to change) ................................................... 117