BGS2-E/BGS2-W Hardware Interface Overview
5.5 Pad Assignment
26
BGS2_HIO_v01.300
Page 24 of 29
2011-03-08
Confidential / Released
5.5
Pad Assignment
The SMT application interface on the BGS2-E/BGS2-W provides connecting pads to integrate
the module into external applications.
Figure 1
shows the connecting pads’ numbering plan,
the following
Table 15
lists the pads’ assignments.
Figure 1:
Numbering plan for connecting pads (bottom view)
53
65
64
63
62
61
60
59
58
57
56
55
54
66
33
21
22
23
24
25
26
27
28
29
30
31
32
20
107
100
99
98
97
96
95
94
93
92
83
84
85
86
88
89
90
91
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
106
105
104
103
102
101
87
44
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
34
35
36
37
38
39
40
41
42
43
45
46
47
48
49
50
51
52
Supply pads: BATT+
Control pads
GND pads
Analog audio pads
ASC0 pads
ASC1 pads
SIM pads
GPIO pads
RF antenna pad
Do not use
ADC pad
Supply pads: Other
