5
Handset Microphone 1
Analog MIC
Close to MIC
2
FB1002
FB0402
MIC_VIN0_P
CON2_0.8MM
4
MIC+
C404
CN403
3
1
100pF
D
MIC-
6.3V
FB1003
FB0402
MIC_VIN0_N
C0201
C405
C406
6.3V
33pF
33pF
6.3V
C0201
C0201
4
Close to BB
MICBIAS0
R401
C407 100nF
1K/1%
6.3V C0201
R0201
R402 1.5K/1%
R0201
C408
1uF
C0402
AU_VIN0_P
[3]
6.3V
C410
10uF
C409
1uF
6.3V
C0402
AU_VIN0_N
[3]
C0603
6.3V
R403
1.5K/1%
R0201
[3]
[3]
R404 1K/1%
R0201
3
Earphone Audio
close to IC
Reserve bead+C footprint for FM
performance tuning
C419
C420
22pF/NC
6.3V
6.3V
22pF/NC
C0201
C0201
FB407
C417 22uF
6.3V
R405
100R
AU_HPL
BLM15HD102SN1
C0603
R0201
FB408
C418 22uF
6.3V
R406
100R
AU_HPR
BLM15HD102SN1
C0603
R0201
2
same power domain
VIO18_PMU
close to connector
R410
470K
R0201
R411
47K
[2]
EINT15_HP
R0201
HP_MP3L
FB409
BLM15HD102SN1
HP_MP3R
FB410
BLM15HD102SN1
C421
33pF
6.3V
C0201
C422
33pF
6.3V
C0201
1
(1) iPhone : L-R-G-M
(2)
瓣夹
: L-R-M-G (V)
D
EAR_L
JP3
EAR_R
EAR_MIC
2
2
EAR_DET
5
EAR_DET
5
EAR_L
4
EAR_FM
EAR_R
3
4
EAR_MIC
EAR_FM
1
3 1
NJP372-102T
HANDSET RECEIVER
close to IC
close to connector
[3]
HSN
FB405
BLM15HD102SN1
HSN_CON
1
HANDSET-1 TP_0.4MM
C411 100pF
C414
6.3V
100pF
C
C0201
6.3V C0201
[3]
HSP
FB406
BLM15HD102SN1
HSP_CON
1
1 TP_0.4MM
C412
C413
C415
C416
测试点焊盘
1.5mm
,两焊盘间距
2mm
33pF
33pF
33pF
33pF
20131023
6.3V
6.3V
6.3V
6.3V
C0201
C0201
C0201
C0201
Earphone MICPHONE
Close to BB
Close to MIC
[3]
AU_VIN1_N
C423 100nF
AU_VIN1_N1
MICBIAS1
GND of C(4.7uF) and headset
should tie together and single
C
via to GND plane
R412 1K
R0201
when choose AUTO,please R416,R418,R411,R414 NC
when choose OMTP,please R416,R418,R415,U401 NC
C428
4.7uF
VBAT
C435 2.2uF
C0603
FB412
50
6.3V
L0603
C430
C431
U402
10uF
100nF AW8736
6.3V
6.3V
C2P
D1
C0603
C0201
[2]
SPK_EN
R423
33R
A4
SHDN
C2N_0
B1
B
R0201
C2N_1
B2
B
4
VOP
C432 22nF
R424
R0402
56K
A2
[3]
AU_HPL
C02016.3V
INN
D4
[3]
AU_HPR
C433 22nF/NC
C02016.3V
R425
R0402
56K
A1
INP
VON
D
3
C441
C434
PVDD
22nF
220pF
C0201
C0201
6.3V
C426
33pF
C425
6.3V C0201
100pF
6.3V
C0201
C427
33pF
6.3V
[3]
AU_VIN1_P
C424 100nF
C0201
C0201
6.3V
R414
1K
[3]
ACCDET
R0201
Speaker
TP1929
TP_0.6MM
C436
2.2uF
C0603
6.3V
FB413
DCR 0.05
SPKL_P
CON2_0.8MM
BLM18EG221SN1D,0603,220R,2A,SMD
1
3
L0603
4
FB414
DCR 0.05
SPKL_N
2
BLM18EG221SN1D,0603,220R,2A,SMD
L0603
C437
C438
CN402
C439
1nF
1nF
4.7uF
C0603
25V C0201
25V C0201
C
0
4
0
2
R
4
1
3
6.3V
C
l
o
s
e
t
o
EarJack
1.5K
R0201
tie together and single via to GND plane
HP_MIC
together then single
via to main GND
when choose CTIA,please
R411,R414,R415,U401 NC
R415
0R/NC
R0201
R416
0R
R0201
FB411
BLM15HD102SN
1
EAR_FM
EAR_MIC
20140317
ES
D
对策
R418
0R
R0201
R419
0R/NC
R0201
L401
82nH
L0402
R420
0R
R0201
CTIA
标准
: R415
,
R419
;
OMTP
标准
: R416
,
R418.
FM_ANT
[10]
FM_RX_N_6627 [10
1
Summary of Contents for Touchbook 7.0 3G
Page 1: ...BLU Touchbook 7 0 3G Service Manual...
Page 14: ...Printed Circuit Main board 8804C A TOP LAYER...
Page 15: ...B L2 LAYER...
Page 16: ...C GND3 LAYER...
Page 17: ...D L4 LAYER...
Page 18: ...E VOLTAGE LAYER...
Page 19: ...F Bottom LAYER...
Page 20: ...Detailed Circuit MAIN BOARD...
Page 45: ...3 Shutdown and reset the device and then connect the device to PC 4 Finish...