233
0208080299932
234
0208080299951
235
0208080299960
236
0210050200193
Multilayer Ceramic Capaci0402,2.2uF,6.3V,X5R,0.5mm,M,SMD/CC0402MRX5R5B
B225/YAGEO
Multilayer Ceramic Capaci0402,152,50V,X7R,NA,K,SMD
Multilayer Ceramic Capaci0402,1uF,10V,X5R,0.5mm,K,SMD/CC0402KRX5R6BB10
5/YAGEO
Chip Registor
0201,10K,1/20W,J,SMD/RC0201JR-0710KL/YAGEO
0201,0R,1/20W,J,SMD/RC0201JR-070RL/YAGEO/RC-
1.000000 C631
3.000000 C722,C728,C732
C602,C683,C717,C7
6.000000
31,C1202,C733
1.000000 R612
237
0210050200202 Chip Registor
238
0210050200206 Chip Registor
239
0210050200248 Chip Registor
240
0210050200249 Chip Registor
01W000JT/FengHua High Technology Corporation
0201,27R,1/20W,J,SMD/RC0201JR-
0727RL/YAGEO/RC-01W27RFT/ FengHua high
technology corporation
0201,1K,1/20W,J,SMD/RC0201JR-0701KL/YAGEO
0201,34.8R,1/20W,F,SMD
2.000000 R640,R641
2.000000 R629,R630
R602,R604,R607,R6
4.000000 08
1.000000 R632
0201,24K,1/20W,J,SMD/RC0201JR-
241
0210050200312 Chip Registor
242
0210050220059 Chip Registor
243
0210050220060 Chip Registor
244
0210050299999 Chip Registor
245
0210080000014 Piezoresistor
246
0218010020010 passive crystal
246
0218010020016 passive crystal
247
0225000020019 passive filter
248
0502220020000 coaxial socket
249
0502220099989 coaxial socket
250
0505080020013 SIM card
251
0617160020142 shielding cover's metal pa
252
0207080000035 patch stacked inductor
253
0207080020046 patch stacked inductor
0724KL/YAGEO/RC-01W243JT/FengHua high
technology corporation
0201,51R,1/20W,J,SMD/RC0201JR-0751RL/YAGEO
0201,2K,1/20W,F,SMD/RC0201FR-072KL/YAGEO
0402,0R,1/16W,J,SMD/RC0402JR-
070RL/YAGEO/CR0402J0000T/HouSheng/RC-
02000JT/FengHua high technology corporation
ES0402V014BT-MP,0402,0.25pF,14V,SMD
7M26000028,26.000MHz,-
10PPM~+10PPM,4P,L3.2*W2.5*H0.7,SMD/TXC
X3S026000B71HZ-HPR,26.000MHz,-
10PPM~+10PPM,4P,L3.2*W2.5*H0.65,
SMD/JiaGao
corporation
RFBLN2012090BM5T25, MLC,2.0*1.2*0.9, SMD/PSA
C168-JL-1663, MHF3, without switch,vertical,SMD
MM8430-2610RB3, I-PEX, with switch, vertical,SMD
JSY-SIM-8-1(with pillar), pop up, SMD/JinShuoYuan
corporation
SMBE7006-PT01,3G sheilding cover,0.2mm tin plate,
pallets,NR
0201,3.0nH,-0.3nH~+0.3nH,
330mA,7@100MHz,SMD
0201,5.6nH,-
0.3nH~+0.3nH,350mA,14@500MHz,SMD/MLG0603P5N
6STZ10/TDK
1.000000
1.000000
1.000000
2.000000
4.000000
1.000000
1.000000
1.000000
1.000000
1.000000
1.000000
1.000000
1.000000
1.000000
R613
R720
R600
R603,R673
RV1201,RV1202,RV1
203,RV1204
Y601
main material
alternative material
Y601
SAW603
ANT601
ANT602
SIM1
L713
L709
254
0208080220083
Multilayer Ceramic Capaci0201,8.2pF,50V,NPO,0.3mm,C,SMD/CC0201CRNPO9B
N8R2/YAGEO
1.000000 C745
0201,5.1nH,-
255
0207080020053
patch stacked inductor
0.3nH~+0.3nH,250mA,5@100MHz,SMD/MLG0603P5N1
2.000000
C740,C748
ST000,halogen free/TDK
256
0207080000057
patch stacked inductor
0201,33nH,-5%~+5%,130mA,10@500MHz,SMD
1.000000
L616
0201,1.5nH,-
257
0207080020054
patch stacked inductor
0.2nH~+0.2nH,800mA,22@800MHz,SMD/MLG0603P1N
1.000000
L702
5CT000,halogen free/TDK
258
0991060020099
259
0210050200211
260
0208080200062
261
0201060300015
262
gravity sensing function coSMB-E7006 motherboard 8804C, with gravity sensing
function component
Chip Registor
0201,100R,1/20W,J,SMD
Multilayer
Ceramic
Capaci0201,104,6.3V,X5R,0.3mm(Max.),K,SMD
acceleration transducer
BMA250E,LGA-12,SMD/BOSCH
SMB-E7006 motherboard 8804C,with front camera
1.000000
2.000000 R1601,R1602
2.000000 C1603,C1604
1.000000 U1602
1.000000
263
0991160020237 camera function compone
264
0210050299999 Chip Registor
0.3Mp+rear camera 2Mp
0402,0R,1/16W,J,SMD/RC0402JR-
070RL/YAGEO/CR0402J0000T/HouSheng
corporation/RC-02000JT/FengHua high technology
1.000000
1.000000 R1503
265
0208080200062
Multilayer Ceramic Capaci0201,104,6.3V,X5R,0.3mm(Max.),K,SMD
3.000000
C1501,C1502,C1503
266
0208080299932
Multilayer Ceramic Capaci0402,2.2uF,6.3V,X5R,0.5mm,M,SMD/CC0402MRX5R5B
B225/YAGEO
2.000000 C1504,C1506
267
0208080299960
Multilayer Ceramic Capaci0402,1uF,10V, X5R, 0.5mm, K,
SMD/CC0402KRX5R6BB105/YAGEO
AXT530124, 0.4mm,30P, double row, vertical, SMD/
1.000000 C1507
268
0502210020020 special socket
Panasonic corporation
1.000000 CN1501
269
0991670020090
earphone standard functioSMB-E7006 motherboard 8804C,with CTIA(APPLE)
standard function configuration
0201,0R,1/20W,J,SMD/RC0201JR-070RL/YAGEO/RC-
1.000000
270
0210050200202 Chip Registor
01W000JT/FengHua high technology corporation
2.000000 R415,R419
271
0991230020134
connector function componSMB-E7006 motherboard 8804C, battery without
coulomb counter(5PIN)
MH1.25-5A, single row, horizontal,SMD/ xinxun
1.000000
272
0502110020012 conventional socket
273
0210050299764 Chip Registor
274
275
0991260020069 motor asembly
technology corporation
0603,0R,1/10W,J,SMD/RC0603JR-070RL/ YAGEO/
CR0603J0000T /HouSheng/RS-03000JT/FengHua high
technology corporation
SMB-E7006 motherboard 8804C, with vibrating motor
function configuration
1.000000 CN1914
2.000000 R909,R910
1.000000
1.000000
276
0208080299960
Multilayer Ceramic Capaci0402,1uF,10V,X5R,0.5mm,K,SMD/CC0402KRX5R6BB10
5/YAGEO
1.000000 C440
Summary of Contents for Touchbook 7.0 3G
Page 1: ...BLU Touchbook 7 0 3G Service Manual...
Page 14: ...Printed Circuit Main board 8804C A TOP LAYER...
Page 15: ...B L2 LAYER...
Page 16: ...C GND3 LAYER...
Page 17: ...D L4 LAYER...
Page 18: ...E VOLTAGE LAYER...
Page 19: ...F Bottom LAYER...
Page 20: ...Detailed Circuit MAIN BOARD...
Page 45: ...3 Shutdown and reset the device and then connect the device to PC 4 Finish...